METHODS OF MODIFYING THE COMPOSITION OF MATERIAL LAYERS

• US 20200135988A1
• Filed: 10/26/2018
• Published: 04/30/2020
• Est. Priority Date: 10/26/2018
• Status: Abandoned Application

• Current Assignee: Tectus Corporation
• Original Assignee: Tectus Corporation
• Inventors: Jiang, Hongjin, Freeman, William
• Application Number:
  US16/172,562
• Publication Number:
  US 20200135988A1
• Time in Patent Office: Days
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Abstract

Methods of modifying the composition of layers using selectively absorbing films are described. The composition of a layer can be modified by applying a selectively absorbing film in proximity to the applied coating and components of the layer can be selectively removed to provide a modified layers. The methods can be used to increase the concentration of particles in the layer.

Claims

1. A method of modifying the composition of a layer, comprising:

(a) applying a selectively absorbing film in proximity to a layer, wherein the layer comprises a first composition, wherein the first composition comprises particles and at least one additional component; and

(b) modifying the first composition by causing at the at least one additional component to absorb into the selectively absorbing film;

to provide a modified layer, wherein the modified layer comprises a second composition comprising particles.

2. The method of claim 1, wherein modifying comprises concentrating the particles, removing the at least one additional component from the first composition, or a combination thereof.

3. The method of claim 1, wherein modifying comprises extracting one or more low molecular weight components from the first composition.

4. The method of claim 1, wherein modifying comprises decreasing a volume of the layer.

5. The method of claim 1, wherein modifying comprises concentrating the particles in the first composition.

6. The method of claim 1, wherein modifying comprises removing one or more components from the first composition.

7. The method of claim 1, wherein the first composition comprises a first vol % of the particles;

the second composition comprises a second vol % of the particles; and

the second vol % is greater than the first vol %.

8. The method of claim 1, wherein the particles comprise a photoactive material.

9. The method of claim 1, wherein the particles comprise quantum dots.

10. The method of claim 1, wherein the layer is disposed within one or more recesses.

11. The method of claim 1, wherein the layer is disposed within one or more recesses, wherein the recesses have a depth from 1 μ

m to 4 μ

m and a width from 1 μ

m to 4 μ

m.

12. The method of claim 1, wherein the first composition comprises:

a first concentration of a first component; and

the second composition comprises a second concentration of the first component,

wherein the second concentration is less than the first concentration.

13. The method of claim 1, wherein a portion of the layer has a first volume, and the portion of the modified layer corresponding to the portion of the layer has a second volume, wherein the second volume is less than the first volume.

14. The method of claim 1, wherein the first composition comprises a first concentration of the particles;

the modified layer comprises a second concentration of the particles;

wherein the second concentration is greater than the first concentration.

15. A modified layer fabricated using the method of claim 1.

16. A cured modified layer prepared by curing the modified layer of claim 15.

17. An electronic device comprising the cured modified layer of claim 16.

18. A method of fabricating one or more pixels, comprising:

providing a substrate comprising one or more recesses, wherein each of the one or more recesses defines a pixel;

depositing a first composition into each of the one or more recesses, wherein the first composition comprises particles and one or more additional components;

applying a selectively absorbing film in proximity to the deposited first composition; and

causing one or more of the additional components of the deposited first composition to absorb into the selectively absorbing film,

to provide one or more pixels comprising a modified first composition.

19. The method of claim 18, wherein,

the first composition comprises a first vol % of the particles;

and

the modified first composition comprises a second vol % of particles,

wherein the second vol % is greater than the first vol %,

wherein vol % is based on the volume of the first composition and the volume of the modified composition, respectively

20. The method of claim 18, further comprising:

depositing a second composition onto the modified first composition, wherein the second composition comprises particles and one or more additional components;

applying a selectively absorbing film in proximity to the deposited second composition; and

causing one or more of the additional components of the deposited second composition to absorb into the selectively absorbing film,

to provide one or more pixels comprising the modified first composition and a modified second composition.

21. The method of claim 18, wherein the particles comprises a photoactive material.

22. The method of claim 18, wherein the particles comprise quantum dots.

23. A pixel fabricated using the method of claim 18.

24. The pixel of claim 23, wherein the particles comprise a plurality of quantum dots.

25. An electronic device comprising the pixel of claim 23.