LED CHIP MOUNTING METHOD AND DEVICE
First Claim
1. An LED chip mounting method, comprising:
- providing a circuit substrate including a plurality of conductive pads;
disposing a plurality of LED chips on the circuit substrate through a pick and place module, each of the LED chips being disposed on at least two conductors;
projecting a laser source generated by a laser generation module to each of the LED chips so that the laser source passes through the LED chip and is projected onto at least two of the conductors; and
curing the conductor disposed between the LED chip and the circuit substrate by irradiation of the laser source, so that the LED chip is mounted on the circuit substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
An LED mounted method includes: providing a circuit substrate having a plurality of conductive pads; through a pick and place module, disposing a plurality of conductors on the conductive pads; disposing a plurality of LED chips on the circuit substrate, with each LED chip being disposed on at least two conductors; projecting a laser source generated by a laser generation module to each LED chip so that the laser source passes through the LED chip and is projected onto at least two conductors; and curing the conductor disposed between the LED chip and the circuit substrate by irradiation of the laser source so that the LED chip is mounted on the circuit substrate.
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Citations
10 Claims
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1. An LED chip mounting method, comprising:
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providing a circuit substrate including a plurality of conductive pads; disposing a plurality of LED chips on the circuit substrate through a pick and place module, each of the LED chips being disposed on at least two conductors; projecting a laser source generated by a laser generation module to each of the LED chips so that the laser source passes through the LED chip and is projected onto at least two of the conductors; and curing the conductor disposed between the LED chip and the circuit substrate by irradiation of the laser source, so that the LED chip is mounted on the circuit substrate. - View Dependent Claims (2, 3, 4)
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5. An LED chip mounting device, comprising:
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a carrier module for carrying a circuit substrate including a plurality of conductive pads, and a plurality of conductors being respectively disposed on the conductive pads; a pick and place module for disposing a plurality of LED chips on the circuit substrate, and each of the LED chips being disposed on at least two of the conductors; and a laser generation module, and that the laser source generated by the laser generation module is directed to each of the LED chips so that the laser source passes through the LED chip and is projected onto at least two of the conductors; wherein the carrier module, the pick and place module, and the laser generation module are adjacent to each other and disposed on the same production line; wherein the conductor disposed between the LED chip and the circuit substrate is cured by irradiation of the laser source so that the LED chip is mounted on the circuit substrate. - View Dependent Claims (6, 7)
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- 8. An LED mounted device, comprising a carrier module, a pick and place module, and a laser generation module, wherein the carrier module, the pick and place module, and the laser generation module are disposed on a same production line, and a laser source generated by the laser generation module is directed to an LED chip so that the laser source passes through the LED chip and is projected onto at least two conductors, and the conductor is cured by irradiation of the laser source, so that the LED chip is mounted on a circuit substrate.
Specification