METHOD OF MANUFACTURING PACKAGE AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE

• US 20200135990A1
• Filed: 10/28/2019
• Published: 04/30/2020
• Est. Priority Date: 10/31/2018
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: MITSUNAGA, Takayuki
• Granted Patent: US 11,056,624 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of manufacturing a package includes providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead. The method further includes disposing the molded resin in a cavity of a mold in a state where the depressed portion of the molded resin is closed, and applying an ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by supplying the ink into the cavity, the ink having a darker color than an inner surface of the depressed portion. The method also includes removing the molded resin from the mold, the molded resin being applied with the ink.

Claims

1. A method of manufacturing a package, the method comprising:

providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead;

disposing the molded resin in a cavity of a mold in a state where the depressed portion of the molded resin is closed;

applying an ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by supplying the ink into the cavity, the ink having a darker color than an inner surface of the depressed portion; and

removing the molded resin from the mold, the molded resin being applied with the ink.

4. The method of manufacturing the package according to claim 1, wherein, in the applying the ink, a viscosity of the ink supplied into the cavity is in a range of at least 300 Pa·

s/0.5 rpm and at most 800 Pa·

s/0.5 rpm.

5. The method of manufacturing the package according to claim 1, wherein, in the applying the ink, a thickness of the ink applied on the resin mold is in a range of 5 μ

m to 20 μ

m.

6. The method of manufacturing the package according to claim 1, wherein the ink contains a filler having an average particle size of at least 10% and less than 50% to the thickness of the applied ink.

7. The method of manufacturing the package according to claim 1,

wherein the molded resin includes a first projecting portion on at least one of the lateral surfaces, and

wherein, in the applying the ink, the ink is applied to a region of the lateral surfaces of the molded resin where an upper surface side from the first projecting portion is.

8. The method of manufacturing the package according to claim 7, wherein the first projecting portion of the molded resin is positioned at a portion lower than a bottom surface of the depressed portion.

9. The method of manufacturing the package according to claim 1,

wherein the molded resin includes a second projecting portion on the upper surface so as to surround an opening of the depressed portion, and

wherein in the applying the ink, the ink is applied to a region of the upper surface of the molded resin while being at lateral surface sides from the second projecting portion.

10. The method of manufacturing the package according to claim 1, wherein

the lead frame includes at least one additional molded resin, the molded resin and the additional molded resin each connected via the lead, and

a mold that includes at least one additional cavity is used in each of the steps of the method.

11. A method of manufacturing a light-emitting device, the method comprising:

manufacturing the package according to claim 1;

mounting a light-emitting element on the depressed portion; and

supplying an encapsulant into the depressed portion to cover the light-emitting element.

2. A method of manufacturing a package, the method comprising:

providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead;

supplying an ink into a cavity of a mold, the ink having a darker color than an inner surface of the depressed portion;

applying the ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by disposing the molded resin in the cavity in which the ink is supplied, in a state where the depressed portion of the molded resin is closed; and

removing the molded resin from the mold, the molded resin being applied with the ink.

3. The method of manufacturing the package according to claim 2, wherein the applying the ink includes resupplying the ink into the cavity after disposing the molded resin inside the cavity in which the ink is supplied.

12. A method of manufacturing a light-emitting device, the method comprising:

providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead;

mounting the light-emitting element on the depressed portion;

supplying an encapsulant into the depressed portion to cover the light-emitting element;

disposing the molded resin in a cavity of a mold in a state where the depressed portion of the molded resin is closed;

applying an ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by supplying the ink into the cavity, the ink having a darker color than an inner surface of the depressed portion; and

removing the molded resin from the mold, the molded resin being applied with the ink.

15. The method of manufacturing the light-emitting device according to claim 12,

wherein the molded resin includes a first projecting portion on at least one of the lateral surfaces, and

wherein, in the applying the ink, the ink is applied to a region of the lateral surfaces of the molded resin where an upper surface side from the first projecting portion is.

16. The method of manufacturing the light-emitting device according to claim 15, wherein the first projecting portion of the molded resin is positioned lower than a bottom surface of the depressed portion.

17. The method of manufacturing the light-emitting device according to claim 12,

wherein the molded resin includes a second projecting portion on the upper surface so as to surround an opening of the depressed portion, and

wherein, in the applying the ink, the ink is applied to a region of the upper surface of the molded resin while being at lateral surfaces sides from the second projecting portion.

18. The method of manufacturing the light-emitting device according to claim 12, wherein

the lead frame includes at least one additional molded resin, the molded resin and the additional molded resin each connected via the lead, and

a mold that includes at least one additional cavity is used in each of the steps of the method.

13. A method of manufacturing a light-emitting device, the method comprising:

providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead;

mounting the light-emitting element on the depressed portion;

supplying an encapsulant into the depressed portion to cover the light-emitting element;

supplying an ink into a cavity of a mold, the ink having a darker color than an inner surface of the depressed portion;

applying the ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by disposing the molded resin in the cavity in which the ink is supplied, in a state where the depressed portion of the molded resin is closed; and

removing the molded resin from the mold, the molded resin being applied with the ink.

14. The method of manufacturing the light-emitting device according to claim 13, wherein the applying the ink includes resupplying the ink into the cavity after disposing the molded resin inside the cavity in which the ink is supplied.