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METHOD OF MANUFACTURING PACKAGE AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE

  • US 20200135990A1
  • Filed: 10/28/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/31/2018
  • Status: Active Grant
First Claim
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1. A method of manufacturing a package, the method comprising:

  • providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead;

    disposing the molded resin in a cavity of a mold in a state where the depressed portion of the molded resin is closed;

    applying an ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by supplying the ink into the cavity, the ink having a darker color than an inner surface of the depressed portion; and

    removing the molded resin from the mold, the molded resin being applied with the ink.

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