Please download the dossier by clicking on the dossier button x
×

LED MOUNTING METHOD AND DEVICE

  • US 20200135996A1
  • Filed: 05/10/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/31/2018
  • Status: Abandoned Application
First Claim
Patent Images

1. An LED mounting method, comprising:

  • providing a circuit substrate including a plurality of conductive solder pads;

    disposing a plurality of LED chips on the circuit substrate, each of the LED chips being disposed on at least two conductors;

    directing a laser source generated by a laser source generation module to each of the LED chips such that the laser source passes through the LED chip and is projected on at least two of the conductors; and

    curing the conductor disposed between the LED chip and the circuit substrate by the laser source such that the LED chip is mounted on the circuit substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×