LED MOUNTING METHOD AND DEVICE
First Claim
1. An LED mounting method, comprising:
- providing a circuit substrate including a plurality of conductive solder pads;
disposing a plurality of LED chips on the circuit substrate, each of the LED chips being disposed on at least two conductors;
directing a laser source generated by a laser source generation module to each of the LED chips such that the laser source passes through the LED chip and is projected on at least two of the conductors; and
curing the conductor disposed between the LED chip and the circuit substrate by the laser source such that the LED chip is mounted on the circuit substrate.
1 Assignment
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Accused Products
Abstract
A mounting method and a mounting device for an LED chip are provided. The mounting method includes: providing a circuit substrate; disposing a plurality of conductors on the conductive solder pads; disposing the plurality of LED chips on the circuit substrate; and directing a laser source generated by a laser source generation module to each LED chip, so that the laser source passes through the LED chip and is projected on at least two conductors. The conductor disposed between the LED chip and the circuit substrate is cured by irradiation of the laser source so that the LED chip is mounted on the circuit substrate. Thereby, the conductor can be cured by the irradiation of the laser source passing through the LED chip, so that the LED chip is mounted on the circuit substrate.
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Citations
10 Claims
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1. An LED mounting method, comprising:
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providing a circuit substrate including a plurality of conductive solder pads; disposing a plurality of LED chips on the circuit substrate, each of the LED chips being disposed on at least two conductors; directing a laser source generated by a laser source generation module to each of the LED chips such that the laser source passes through the LED chip and is projected on at least two of the conductors; and curing the conductor disposed between the LED chip and the circuit substrate by the laser source such that the LED chip is mounted on the circuit substrate. - View Dependent Claims (2, 3, 4)
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5. An LED mounting device, comprising:
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a carrier module for carrying a circuit substrate, the circuit substrate including a plurality of conductive solder pads, and a plurality of conductors being respectively disposed on the conductive solder pads; a pick and place module for disposing a plurality of LED chips on the circuit substrate, each of the LED chips being disposed on at least two of the conductors; and a laser source generation module, the generated laser source being directed to each of the LED chips, such that the laser source passes through the LED chip and is projected on at least two of the conductors; wherein the conductor disposed between the LED chip and the circuit substrate is cured by irradiation of the laser source, so that the LED chip is mounted on the circuit substrate. - View Dependent Claims (6, 7)
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8. An LED mounting device, comprising a carrier module, a pick and place module, and a laser source generation module;
- wherein a laser source generated by the laser source generation module is directed to an LED chip, so that the laser source passes through the LED chip and is projected on at least two conductors, and the conductor is cured by irradiation of the laser source such that the LED chip is mounted on a circuit substrate.
- View Dependent Claims (9, 10)
Specification