LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE, METHOD OF MANUFACTURING LIGHT EMITTING DEVICE, AND METHOD OF MANUFACTURING LIGHT EMITTING MODULE

• US 20200135998A1
• Filed: 10/31/2019
• Published: 04/30/2020
• Est. Priority Date: 10/31/2018
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: DAIKOKU, Shinichi, HASHIMOTO, Toru
• Granted Patent: US 11,264,552 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0083 Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The light emitting device includes: a light emitting element, a covering member, a pair of electrode layers, and a pair of electrode terminals. The light emitting element has an electrode-formed surface on which a pair of electrode posts are formed. The covering member covers an electrode-formed surface of the light emitting element while forming an exposed portion of each of the pair of electrode posts which is exposed from the covering member. The pair of electrode layers are provided on a surface of the covering member and electrically connected to the exposed portions of the pair of electrode posts. The pair of electrode terminals are electrically connected to the pair of electrode layers, and provided on the surface of the covering member. The pair of electrode terminals are thicker than the pair of electrode layers, and are disposed at an interval larger than an interval between the pair of electrode posts.

Claims

1. A light emitting device comprising:

a light emitting element having an electrode-formed surface on which a pair of electrode posts are formed;

a covering member covering the electrode-formed surface of the light emitting element while forming an exposed portion of each of the pair of electrode posts which are exposed from the covering member;

a pair of electrode layers provided on a surface of the covering member and electrically connected to the exposed portions of the pair of electrode posts; and

a pair of electrode terminals electrically connected to the pair of electrode layers, and provided on the surface of the covering member, wherein the pair of electrode terminals are thicker than the pair of electrode layers, and are disposed at an interval larger than an interval between the pair of electrode posts.

2. The light emitting device according to claim 1, wherein the electrode-formed surface of the light emitting element has a quadrangular shape, and

the pair of electrode terminals are disposed at symmetric positions on the outer edge of the electrode-formed surface.

3. The light emitting device according to claim 1, wherein the electrode-formed surface of the light emitting element has a quadrangular shape,

the electrode-formed surface is provided with an insulating region having no electrode layer, and

the insulating region is an inter-electrode slit.

4. The light emitting device according to claim 3, wherein the inter-electrode slit is the insulating region formed on the electrode-formed surface and has an inclined slit extending in a diagonal direction from a central portion of the electrode-formed surface.

5. The light emitting device according to claim 4, wherein the inter-electrode slit as the insulating region has parallel slits respectively connected to end portions of the inclined slit, and

the parallel slits are parallel to each other, and extend in a direction parallel to two opposed sides of the electrode-formed surface.

6. The light emitting device according to claim 5, wherein the angle formed by the inclined slit and one of the parallel slits is an obtuse angle, and

the pair of electrode layers are provided on each of both sides of the slit, and have a wide portion and a narrow portion.

7. The light emitting device according to claim 5, wherein the pair of electrode terminals have an elongated shape extending in the extending direction of the parallel slits.

8. The light emitting device according to claim 5 wherein the pair of electrode terminals are disposed in regions which are opposed corner portions of the covering member, and exclude the central portion of the electrode-formed surface.

9. The light emitting device according to claim 6, wherein

the pair of electrode terminals are respectively disposed in regions which are corner portions facing each other in the quadrangular electrode-formed surface, and exclude the central portion of the electrode-formed surface, and

the pair of electrode posts are disposed at the central portion of the electrode-formed surface.

10. The light emitting device according to claim 1, wherein a thickness of the pair of electrode terminals is not less than 10 times a thickness of the pair of electrode layers.

11. A light emitting module comprising:

the light emitting device according to claim 1; and

a light-transmissive light guiding plate having a second principal surface on which a recessed portion is formed on a side opposite to a first principal surface serving as a light emitting surface from which light exits,

the light emitting device being disposed in the recessed portion of the light guiding plate.

12. A method of manufacturing a light emitting device, comprising:

providing an intermediate body in which a light emitting element including a pair of electrode posts formed on an electrode-formed surface is covered with a covering member, and the covering member forms exposure portions of the pair of electrode posts exposed from the covering member;

forming a pair of electrode layers on a surface of the covering member, the pair of electrode layers being electrically connected to the exposed portions of the pair of electrode posts in the intermediate body; and

providing a pair of electrode terminals, which are electrically connected to the pair of the electrode layers and which are thicker than the pair of electrode layers, so as to be disposed at an interval larger than an interval between the pair of electrode posts.

13. The method of manufacturing a light emitting device according to claim 12, wherein the pair of electrode layers are formed using a metal thin film, and a metal paste is applied to a surface of the pair of electrode layers to provide the pair of electrode terminals.

14. The method of manufacturing a light emitting device according to claim 12, wherein in the step of forming the pair of electrode layers, a metal layer is formed on the surface of the covering member, and

the metal layer is separated into a plurality of the electrode layers by irradiating the metal layer with laser light to remove part of the metal layer.

15. A method of manufacturing a light emitting module, comprising:

providing the light emitting device manufactured by the method according to claim 12, and

providing a light guiding plate having a first principal surface serving as a light emitting surface, and a second principal surface on which a recessed portion is formed, the second principal surface being positioned on a side opposite to the first principal surface;

bonding the light emitting device to the recessed portion;

providing a light-reflective member on the second principal surface of the light guiding plate so as to embed the light emitting device; and

polishing the light-reflective member to expose the electrode terminals, and forming an electrically conductive film on surfaces of the exposed electrode terminals.