LED Light Source

• US 20200136001A1
• Filed: 10/23/2019
• Published: 04/30/2020
• Est. Priority Date: 10/26/2018
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Lumileds Holding B.V. (Apollo Global Management, Inc.)
• Inventors: Wang, Zhaoxin, Golubovic, Dusan, Cheng, Shen, Li, Jasmine, Cui, Min
• Granted Patent: US 11,158,777 B2
• Time in Patent Office: Days
• CPC Class Codes: F21V 23/009 the casing being inside the housing of the lighting device
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/87 Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

An LED light source is described herein, which comprises: a hollow heat sink having a top wall, a bottom opening, and a sidewall, the top wall including an upper surface and a lower surface, the upper surface having a central area and a peripheral area, and the top wall having at least one first hole in the peripheral area; an interposer being overmolded on the peripheral area and the lower surface, and extending through the at least one first hole; an LED package comprising at least one LED chip and mounted in the central area; an LED driver located within the hollow heat sink and positioned on a side of the interposer facing the bottom opening.

Claims

1. An LED light source, comprising

a hollow heat sink having a top wall, a bottom opening, and a sidewall between the top wall and the bottom opening, the top wall including an upper surface facing away from the bottom opening and a lower surface facing the bottom opening, the upper surface having a central area and a peripheral area surrounding the central area, and the top wall having at least one first hole in the peripheral area of the upper surface;

an interposer made of thermally conductive and electrically insulating material, the interposer being overmolded on the peripheral area of the upper surface and the lower surface of the top wall, and extending through the at least one first hole;

an LED package comprising at least one LED chip and mounted in the central area of the upper surface of the top wall;

an LED driver located within the hollow heat sink and positioned on a side of the interposer facing the bottom opening to be electrically insulated from the hollow heat sink, and configured to provide driving current to the at least one LED chip.

2. The LED light source according to claim 1, further comprising a rear case located within the hollow heat sink and arranged to support the LED driver between the rear case and the interposer.

3. The LED light source according to claim 1, wherein the LED package further comprises:

a leadframe on which the at least one LED chip is arranged; and

a transparent encapsulation material with which the at least one LED chip and part of the leadframe are overmolded.

4. The LED light source according to claim 3, wherein the transparent encapsulation material comprises transparent epoxy or silicone.

5. The LED light source according to claim 3, wherein the leadframe comprises at least one second hole that is not overmolded with the transparent encapsulation material, through which connecting wires electrically connect the LED driver to the at least one LED chip.

6. The LED light source according to claim 3, wherein the leadframe is made of silver-plated copper.

7. The LED light source according to claim 3, wherein the transparent encapsulation material is shaped on a side of the leadframe where the at least one LED chip is located to shape the light output of the at least one LED chip.

8. The LED light source according to claim 1, wherein the central area of the upper surface of the top wall is raised above the peripheral area of the upper surface.

9. The LED light source according to claim 1, wherein the LED driver comprises a printed circuit board.

10. The LED light source according to claim 1, wherein the material of the interposer comprises resin, plastic, or nylon.

11. The LED light source according to claim 1, wherein a material of the heat sink comprises aluminum or copper.

12. The LED light source according to claim 1, wherein the hollow heat sink has a hollow cylindrical shape.

13. The LED light source according to claim 12, wherein the bottom opening has a diameter of 20-30 mm

14. The LED light source according to claim 1, wherein the sidewall has a thickness of 1-1.5 mm