METHOD OF MANUFACTURING AN OLED DISPLAY DEVICE AND OLED DISPLAY DEVICE

• US 20200136047A1
• Filed: 11/16/2017
• Published: 04/30/2020
• Est. Priority Date: 09/28/2017
• Status: Abandoned Application

• Current Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: TANG, Jia, ZHANG, Xiaoxing
• Application Number:
  US15/578,409
• Publication Number:
  US 20200136047A1
• Time in Patent Office: Days
• CPC Class Codes: G03F 7/0007 Filters, e.g. additive colour filters; Components for display devices
• CPC Class Codes: G03F 7/038 Macromolecular compounds which are rendered insoluble or differentially wettable G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021
• CPC Class Codes: G03F 7/091 characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
• CPC Class Codes: H10K 2102/103 comprising indium oxides, e.g. ITO
• CPC Class Codes: H10K 2102/3026 Top emission
• CPC Class Codes: H10K 50/818 Reflective anodes, e.g. ITO combined with thick metallic layers
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/80518 Reflective anodes, e.g. ITO combined with thick metallic layers
• CPC Class Codes: H10K 59/8792 comprising light absorbing layers, e.g. black layers
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/233 by photolithographic etching

Abstract

A method of manufacture OLED display device and an OLED display device are provided. The method of manufacture OLED display device includes following steps. Forming antireflective layer on anode layer of TFT substrate. Coating negative photoresist material layer on antireflective layer and TFT substrate. Forming pixel defining layer by exposure-and-development process to negative photoresist material layer. Because of the antireflective layer, it could effectively avoids the exposure light be reflected to negative photoresist material corresponding pixel regions by anode and causes photoresist be left on the pixel region when exposure process to the negative photoresist material, by structure of anode is a layer of silver between double indium tin oxide layers. The method of the present invention has no photoresist be left on pixel region such that the OLED emitting layer is uniform thickness and enhances quality of OLED display.

Claims

1. A method of manufacture OLED display device, comprising steps of:

step S1, providing a TFT substrate, the TFT substrate includes a substrate element and an anode layer positioned on the substrate element;

step S2, forming an antireflective layer on the TFT substrate, and patterning the antireflective layer for forming a plurality of first openings exposing the anode layer;

step S3, forming a negative photoresist material layer on the TFT substrate and the antireflective layer, and forming a pixel defining layer by exposure-and-development process to the negative photoresist material layer,

wherein a plurality of second openings corresponding to the plurality of first openings are pass through and formed on the pixel defining layer, a plurality of pixel regions on the TFT substrate are defined by the plurality of second openings and the plurality of first openings positioned below the plurality of second openings; and

step S4, forming an OLED emitting layer on the plurality of pixel regions of the TFT substrate.

2. The method of manufacture OLED display device according to claim 1, wherein structure of the anode is a layer of silver between double indium tin oxide layers.

3. The method of manufacture OLED display device according to claim 1, wherein the antireflective layer is organic photoresist material,

wherein specifically step S2 patterning the antireflective layer on the TFT substrate which is exposure-and-development process to the antireflective layer for forming the plurality of first openings on the antireflective layer.

4. The method of manufacture OLED display device according to claim 1, wherein the antireflective layer is organic shielding material;

wherein specifically step S2 pattering the antireflective layer on the TFT substrate which is coating a photoresist layer on the antireflective layer and exposure-and-development process to the photoresist layer, and etching region of the antireflective layer shielded by the developed phtoresist layer for forming the plurality of first openings on the antireflective layer.

5. The method of manufacture OLED display device according to claim 1, wherein the antireflective layer is absorption material.

6. The method of manufacture OLED display device according to claim 1, wherein step S4 forming the OLED emitting layer on the plurality of pixel regions of TFT substrate is by stamping or evaporation.

7. The method of manufacture OLED display device according to claim 6, wherein the step S4 forming the OLED emitting layer on the plurality of pixel regions of TFT substrate which is by stamping process;

wherein the negative photoresist material layer is hydrophobic material.

8. An OLED display device, comprises:

a TFT substrate includes a substrate element and an anode layer positioned on the substrate element;

an antireflective layer positioned on the TFT substrate, and a plurality of first openings exposing the anode layer located on the antireflective layer;

a pixel defining layer positioned on the antireflective layer, and a plurality of second openings are corresponding to the plurality of first openings are pass through and formed on the pixel defining layer, a plurality of pixel regions on the TFT substrate are defined by the plurality of second openings and the plurality of first openings positioned below the plurality of second openings; and

an OLED emitting layer on the plurality of pixel regions of the TFT substrate;

wherein the pixel defining layer is made by negative photoresist material.

9. The OLED display device according to claim 8, wherein structure of the anode is a layer of silver between double indium tin oxide layers.

10. The OLED display device according to claim 8, wherein the antireflective layer is shielding material or absorption material.

11. A method of manufacture OLED display device, comprising steps of:

step S1, providing a TFT substrate, the TFT substrate includes a substrate element and an anode layer positioned on the substrate element;

step S2, forming an antireflective layer on the TFT substrate, and patterning the antireflective layer for forming a plurality of first openings exposing the anode layer;

step S3, forming a negative photoresist material layer on the TFT substrate and the antireflective layer, and forming a pixel defining layer by exposure-and-development process to the negative photoresist material layer,

wherein a plurality of second openings corresponding to the plurality of first openings are pass through and formed on the pixel defining layer, a plurality of pixel regions on the TFT substrate are defined by the plurality of second openings and the plurality of first openings positioned below the plurality of second openings; and

step S4, forming an OLED emitting layer on the plurality of pixel regions of the TFT substrate;

wherein structure of the anode is a layer of silver between double indium tin oxide layers;

wherein step S4 forming the OLED emitting layer on the plurality of pixel regions of TFT substrate which is by stamping process or evaporation process.

12. The method of manufacture OLED display device according to claim 11, wherein the antireflective layer is organic photoresist material;

wherein specifically step S2 patterning the antireflective layer on the TFT substrate which is exposure-and-development process to the antireflective layer for forming the plurality of first openings on the antireflective layer.

13. The method of manufacture OLED display device according to claim 11, wherein the antireflective layer is organic shielding material;

wherein specifically step S2 patterning the antireflective layer on the TFT substrate which is coating a photoresist layer on the antireflective layer and exposure-and-development process to the photoresist layer, and etching region of the antireflective layer shielded by the developed phtoresist layer for forming the plurality of first openings on the antireflective layer.

14. The method of manufacture OLED display device according to claim 11, wherein the antireflective layer is absorption material.

15. The method of manufacture OLED display device according to claim 11, wherein the step S4 forming the OLED emitting layer on the plurality of pixel regions of TFT substrate which is by stamping;

wherein the negative photoresist material layer is hydrophobic material.