TRANSPARENT ORGANIC LIGHT EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
First Claim
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1. A transparent organic light emitting display apparatus comprising:
- a pixel area including an emission area and a transmission area disposed adjacent to the emission area, the emission area configured to display an image and the transmission area configured to pass external light,wherein the transmission area includes;
a planarization layer covering a thin film transistor of the emission area, and including an overhanging portion,an encapsulation layer disposed on the planarization layer, andan undercut area disposed below the overhanging portion of the planarization layer, and filled by the encapsulation layer.
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Abstract
A transparent organic light emitting display apparatus and a method of manufacturing the same are discussed. The transparent organic light emitting display apparatus can comprise an emission area, a transmission area disposed adjacent to the emission area and configured to pass external light therethrough, and an undercut area formed in the transmission area, wherein the undercut area is filled by an encapsulation layer.
7 Citations
20 Claims
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1. A transparent organic light emitting display apparatus comprising:
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a pixel area including an emission area and a transmission area disposed adjacent to the emission area, the emission area configured to display an image and the transmission area configured to pass external light, wherein the transmission area includes; a planarization layer covering a thin film transistor of the emission area, and including an overhanging portion, an encapsulation layer disposed on the planarization layer, and an undercut area disposed below the overhanging portion of the planarization layer, and filled by the encapsulation layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of manufacturing a transparent organic light emitting display apparatus having an emission area, and a transmission area disposed adjacent to the emission area and configured to pass external light therethrough, the method comprising:
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sequentially forming an interlayer dielectric and a first protection layer on a first substrate; patterning a planarization layer over the first protection layer; forming an organic light emitting device over the planarization layer; and forming an encapsulation layer and an encapsulation substrate over the organic light emitting device, wherein at least some portions of the transmission area are exposed and etched by using photolithography after the patterning of the planarization layer. - View Dependent Claims (19, 20)
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Specification