ELECTROPLATING OF NIOBIUM TITANIUM

• US 20200136223A1
• Filed: 10/25/2018
• Published: 04/30/2020
• Est. Priority Date: 10/25/2018
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: DeGraw, Danielle, Fung, Yat-Kiu-Kent, Rozen, James Robert
• Granted Patent: US 11,075,435 B2
• Time in Patent Office: Days
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 1/203 Fluxing, i.e. applying flux onto surfaces
• CPC Class Codes: B23K 2101/38 Conductors
• CPC Class Codes: B23K 2103/12 Copper or alloys thereof
• CPC Class Codes: B23K 2103/166 Multilayered materials
• CPC Class Codes: B23K 2103/18 Dissimilar materials
• CPC Class Codes: B23K 2103/26 Alloys of Nickel and Cobalt and Chromium
• CPC Class Codes: C25D 3/12 of nickel or cobalt
• CPC Class Codes: C25D 3/38 of copper
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: C25D 5/34 Pretreatment of metallic surfaces to be electroplated
• CPC Class Codes: C25D 5/38 of refractory metals or nickel
• CPC Class Codes: C25D 7/0607 Wires
• CPC Class Codes: H01B 1/02 mainly consisting of metals or alloys
• CPC Class Codes: H01B 11/1817 Co-axial cables with at least one metal deposit conductor
• CPC Class Codes: H01B 12/00 Superconductive or hyperconductive conductors, cables, or transmission lines
• CPC Class Codes: H01B 13/016 for manufacturing co-axial cables applying discontinuous insulation H01B13/20
• CPC Class Codes: H01P 11/005 Manufacturing coaxial lines
• CPC Class Codes: H01P 3/06 : Coaxial lines

Abstract

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

Claims

1. A structure, comprising:

a niobium titanium substrate; and

a metal layer plated on a portion of the niobium titanium substrate.

2. The structure of claim 1, wherein the metal layer comprises an electroplated metal layer plated on the portion of the niobium titanium substrate using electroplating.

3. The structure of claim 1, wherein the metal layer comprises a metal selected from a group consisting of copper and nickel.

4. The structure of claim 1, wherein the metal layer comprises a first layer of nickel adhered directly to a surface of the portion of the niobium titanium substrate, and second layer of copper adhered to the first layer of nickel.

5. The structure of claim 1, further comprising:

a metal contact surface soldered to the metal layer.

6. The structure of claim 5, wherein the metal contact surface comprises copper.

7. The structure of claim 5, wherein the metal contact surface comprises a surface of a coaxial connector.

8. The structure of claim 7, wherein the coaxial connector comprises a microwave coaxial connector.

9. The structure of claim 7, wherein the coaxial connector comprises a sub-miniature version A (SMA) type connector.

10. The structure of claim 1, wherein the niobium titanium substrate comprises a niobium titanium wire.

11. A cable assembly, comprising:

a niobium titanium wire;

a metal layer plated on a first portion of the niobium titanium wire; and

a metal coaxial connector soldered to the metal layer.

12. The cable assembly of claim 11, wherein the metal layer comprises an electroplated metal layer plated on the first portion of the niobium titanium wire using electroplating.

13. The cable assembly of claim 11, wherein the metal layer comprises a metal selected from a group consisting of copper and nickel.

14. The cable assembly of claim 11, wherein the metal coaxial connector comprises a microwave connector.

15. The cable assembly of claim 11, further comprising:

a qubit attached to the metal coaxial connector; and

an amplifier attached to a second portion of the niobium titanium wire.

16. A method, comprising:

preparing a surface of a niobium titanium substrate, resulting in a prepared surface, wherein the preparing comprises sanding the surface of the niobium titanium substrate; and

electroplating a metal film onto the prepared surface, wherein the metal film comprises a metal selected from a group consisting of nickel and copper.

17. The method of claim 16, wherein the preparing further comprises, prior to the sanding, polishing the surface of the niobium titanium substrate using a mechanical polishing wheel.

18. The method of claim 16, wherein the preparing further comprises, after the sanding, dipping the surface of the niobium titanium substrate in a hydrochloric acid solution.

19. The method of claim 16, further comprising:

soldering a metal surface to the metal film.

20. The method of claim 16, wherein the niobium titanium substrate comprises a niobium titanium wire.