RADIO-FREQUENCY SIGNAL GROUNDING DEVICE AND ANTENNA

• US 20200136246A1
• Filed: 09/26/2019
• Published: 04/30/2020
• Est. Priority Date: 10/29/2018
• Status: Active Grant

• Current Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Original Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Inventors: Zhang, Xun, Wu, Ligang, Wu, Bo, Wang, Xiaotuo
• Granted Patent: US 10,879,604 B2
• Time in Patent Office: Days
• CPC Class Codes: H01P 1/2007 Filtering devices for biasing networks or DC returns
• CPC Class Codes: H01P 3/08 Microstrips; Strip lines
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 15/14 Reflecting surfaces; Equivalent structures electromagnetic shields H01Q1/526

Abstract

A radio-frequency signal grounding device for an antenna comprises: a substrate layer; a grounding transmission line on a first side of the substrate layer; a metal layer on a second side of the substrate layer, the metal layer including at least one gap such that the metal layer is divided into at least a first sub-region and a second sub-region, where the gap is configured to block at least one of a low frequency signal and a direct current signal; a metal plate; and a dielectric layer that is disposed between the metal plate and the metal layer. The radio-frequency signal grounding device can achieve good radio-frequency signal grounding and low frequency/direct current signal blocking within a limited space via a multi-coupling design.

Claims

1. A RF signal grounding device for an antenna comprising:

a substrate layer;

a grounding transmission line on a first side of the substrate layer;

a metal layer on a second side of the substrate layer, the metal layer including at least one gap such that the metal layer is divided into at least a first sub-region and a second sub-region, wherein the gap is configured to block at least one of a low frequency signal and a direct current signal;

a metal plate; and

a dielectric layer that is disposed between the metal plate and the metal layer.

2. The RF signal grounding device for an antenna according to claim 1, wherein the dielectric layer comprises a solder mask layer and/or air.

3. The RF signal grounding device for an antenna according to claim 1, wherein the metal layer has two or more gaps such that the metal layer is divided into a first sub-region, a second sub-region, and one or more additional regions, the first sub-region and the second sub-region being spaced apart from one another by the one or more additional regions.

4. The RF signal grounding device for an antenna according to claim 1, wherein the grounding transmission line is electrically connected to the first sub-region through the substrate layer.

5. The RF signal grounding device for an antenna according to claim 4, wherein the substrate layer is provided with at least one conductive via hole, and the grounding transmission line is electrically connected to the first sub-region via the conductive via hole.

6. The RF signal grounding device for an antenna according to claim 1, wherein the metal layer is a copper layer.

7. The RF signal grounding device for an antenna according to claim 1, wherein the first sub-region is configured as a polygonal region or a region with a circular arc.

8. The RF signal grounding device for an antenna according to claim 7, wherein the first sub-region is configured as a rectangular region, a triangular region, a hexagonal region or an octagonal region.

9. The RF signal grounding device for an antenna according to claim 1, wherein the gap is filled with air.

10. The RF signal grounding device for an antenna according to claim 9, wherein the gap is completely or partly filled with solid dielectric materials.

11. The RF signal grounding device for an antenna according to claim 1, wherein the substrate layer is a paper substrate, a glass fiber fabric substrate, or a composite substrate.

12. The RF signal grounding device for an antenna according to claim 1, wherein the area of the first sub-region, the thickness of the metal layer and/or the width of the gap are selected based on a frequency range of the RF signal.

13. The RF signal grounding device for an antenna according to claim 12, wherein the thickness of the metal layer is between 0.02 mm and 0.3 mm.

14. The RF signal grounding device for an antenna according to claim 12, wherein the width of the gap is between 0.01 mm and 1 mm.

15. The RF signal grounding device for an antenna according to claim 1, wherein the metal plate is a reflector of the antenna.

16. The RF signal grounding device for an antenna according to claim 1, wherein the metal plate is connected to the metal layer only via the solder mask layer.

17. A radio-frequency (RF) signal grounding device for an antenna comprising:

a printed circuit board that includes a dielectric substrate, a grounding transmission line on a first major surface of the dielectric substrate and a metal pattern having a first region on a second major surface of the dielectric substrate,

wherein the first region is capacitively coupled to a grounded element of the antenna.

18. The RF signal grounding device for an antenna according to claim 17, wherein the printed circuit board includes a conductive that electrically connects the grounding transmission line to the first region of the metal pattern.

19. The RF signal grounding device for an antenna according to claim 18, wherein the metal pattern further includes a second region on a second major surface of the dielectric substrate that is capacitively coupled to the first region.

20. The RF signal grounding device for an antenna according to claim 19, wherein the first region is capacitively coupled to the grounded element via a first capacitive connection to the second region and via a second capacitive connection to the grounded element.