METHOD AND SYSTEM FOR LARGE SILICON PHOTONIC INTERPOSERS BY STITCHING

• US 20200136317A1
• Filed: 12/30/2019
• Published: 04/30/2020
• Est. Priority Date: 06/02/2015
• Status: Active Grant

• Current Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Original Assignee: Luxtera Incorporated (Cisco Systems, Inc.)
• Inventors: De Dobbelaere, Peter, Mekis, Attila, Masini, Gianlorenzo
• Granted Patent: US 10,879,648 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 6/1228 Tapered waveguides, e.g. integrated spot-size transformers for coupling with fibres G02B6/305
• CPC Class Codes: G02B 6/34 utilising prism or grating G02B6/293 takes precedence
• CPC Class Codes: G02B 6/4279 Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01R 13/6461 Means for preventing cross-talk
• CPC Class Codes: H01R 13/6471 by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
• CPC Class Codes: H01R 13/6585 Shielding material individually surrounding or interposed between mutually spaced contacts
• CPC Class Codes: H01R 13/6586 for separating multiple connector modules
• CPC Class Codes: H01R 13/6588 with through openings for individual contacts
• CPC Class Codes: H01R 13/6594 the shield being mounted on a PCB and connected to conductive members
• CPC Class Codes: H01R 2107/00 Four or more poles
• CPC Class Codes: H01R 24/60 Contacts spaced along planar side wall transverse to longitudinal axis of engagement
• CPC Class Codes: H01R 25/006 the coupling part being secured to apparatus or structure, e.g. duplex wall receptacle
• CPC Class Codes: H04B 10/801 using optical interconnects, e.g. light coupled isolators, circuit board interconnections

Abstract

Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an optical communication system including a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between first and second reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.

Claims

1. A method for communication, the method comprising:

in an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, wherein the silicon photonic interposer comprises a plurality of reticle sections;

communicating an optical signal between two of said plurality of reticle sections utilizing a waveguide, wherein said waveguide comprises a taper region at a boundary between said two of said plurality of reticle sections, said taper region expanding an optical mode of said communicated optical signal prior to said boundary and narrowing said optical mode after said boundary.

2. The method according to claim 1, comprising receiving a continuous wave (CW) optical signal in a first reticle section of said two of said plurality of reticle sections in said silicon photonic interposer from an optical source external to said silicon photonic interposer.

3. The method according to claim 2, comprising receiving said CW optical signal in said silicon photonic interposer from an optical source assembly coupled to a grating coupler in said first reticle section in said silicon photonic interposer.

4. The method according to claim 2, comprising communicating said CW optical signal from said first reticle section to a second reticle section of said two of said plurality of reticle sections utilizing said second waveguide.

5. The method according to claim 2, comprising generating a modulated optical signal by processing said received CW optical signal based on a first electrical signal received from a silicon electronics die coupled to said silicon photonic interposer.

6. The method according to claim 5, comprising processing said received CW optical signal utilizing an optical modulator in said silicon photonic interposer.

7. The method according to claim 5, comprising communicating said generated modulated optical signal between said two of said plurality of reticle sections.

8. The method according to claim 7, comprising generating a second electrical signal using a photodetector integrated in said silicon photonic interposer.

9. The method according to claim 2, comprising receiving said CW optical signal from an optical fiber coupled to said first reticle section of said silicon photonic interposer.

10. The method according to claim 1, wherein said increased width comprises a region of expansion from a first width up to a second width and a region extending to said boundary between said two of said plurality of reticle sections at said second width.

11. A method for communication, the method comprising:

in an optical communication system comprising a silicon photonic interposer, wherein the silicon photonic interposer comprises a plurality of reticle sections;

communicating an optical signal between two of said plurality of reticle sections utilizing a first waveguide in a first reticle section and a second waveguide in a second reticle section, wherein said first and second waveguides comprise an increased width at a boundary between said first and second reticle sections.

12. The method according to claim 11, comprising receiving a continuous wave (CW) optical signal in said first reticle section in said silicon photonic interposer from an optical source external to said silicon photonic interposer.

13. The method according to claim 12, comprising receiving said CW optical signal in said silicon photonic interposer from an optical source assembly coupled to a grating coupler in said first reticle section in said silicon photonic interposer.

14. The method according to claim 12, comprising communicating said CW optical signal from said first reticle section to said second reticle section utilizing said second waveguide.

15. The method according to claim 12, comprising generating a modulated optical signal by processing said received CW optical signal based on a first electrical signal received from a silicon electronics die coupled to said silicon photonic interposer.

16. The method according to claim 15, comprising processing said received CW optical signal utilizing an optical modulator in said silicon photonic interposer.

17. The method according to claim 15, comprising communicating said generated modulated optical signal between two of said plurality of reticle sections.

18. The method according to claim 17, comprising generating a second electrical signal using a photodetector integrated in said silicon photonic interposer.

19. The method according to claim 12, comprising receiving said CW optical signal from an optical fiber coupled to said reticle section of said silicon photonic interposer.

20. The method according to claim 11, wherein said increased width comprises a region of expansion from a first width up to a second width and a region extending to said boundary between said first and second reticle sections at said second width.

21. A system for communication, the system comprising:

an optical communication system comprising a silicon photonic interposer, wherein the silicon photonic interposer comprises a plurality of reticle sections, said optical communication system being operable to;

communicate an optical signal between two of said plurality of reticle sections utilizing a first waveguide in a first reticle section and a second waveguide in a second reticle section, wherein said first and second waveguides comprise an increased width at a boundary between said first and second reticle sections.

22. The system according to claim 21, wherein said optical communication system is operable to receive a continuous wave (CW) optical signal in said first reticle section in said silicon photonic interposer from an optical source external to said silicon photonic interposer.

23. The system according to claim 22, wherein said optical communication system is operable to receive said CW optical signal in said silicon photonic interposer from an optical source assembly coupled to a grating coupler in said first reticle section in said silicon photonic interposer.

24. The system according to claim 22, wherein said optical communication system is operable to communicate said CW optical signal from said first reticle section to said second reticle section utilizing said second waveguide.

25. The system according to claim 22, wherein said optical communication system is operable to generate a modulated optical signal by processing said received CW optical signal based on a first electrical signal received from a silicon electronics die coupled to said silicon photonics interposer.

26. The system according to claim 25, wherein said optical communication system is operable to process said received CW optical signal utilizing an optical modulator in said silicon photonic interposer.

27. The system according to claim 21, wherein said optical communication system is operable to communicate said generated modulated optical signal between said first and second reticle sections.

28. The system according to claim 27, wherein said optical communication system is operable to generate a second electrical signal using a photodetector integrated in said silicon photonic interposer.

29. The system according to claim 21, wherein said increased width comprises a region of expansion from a first width up to a second width and a region extending to said boundary between said first and second reticle sections at said second width.

30. A system for communication, the system comprising:

an optical communication system comprising a silicon photonic interposer, wherein the silicon photonic interposer comprises a plurality of reticle sections, said integrated optical communication system being operable to;

communicate an optical signal between two of said plurality of reticle sections utilizing a first waveguide in a first reticle section and a second waveguide in a second reticle section, wherein said first and second waveguides comprise an increased width at a boundary between said first and second reticle sections, said increased width comprising a region of expansion from a first width increasing to a second width extending to said boundary between said first and second reticle sections.