SEMICONDUCTOR LASER DEVICE
First Claim
1. A semiconductor laser device comprising:
- a semiconductor laser element to emit laser light;
a submount electrically connected with the semiconductor laser element disposed on an upper surface of the submount, the submount being made of a conductive material;
a lower electrode block that is disposed below the submount and that is electrically connected with the submount, the lower electrode block having a submount disposition space to allow the submount to be disposed on an upper surface of the lower electrode block, the lower electrode block includingat least a pair of first connection holes formed on both sides of the submount disposition space,a pair of second connection holes formed on both sides of the submount disposition space so as to be separated from the first connection holes, anda first terminal hole formed so as to be separated from the submount disposition space and the first and the second connection holes;
an upper electrode block disposed over the lower electrode block so as to cover the submount and the semiconductor laser element, the upper electrode block includinga pair of third connection holes communicating with the respective first connection holes, anda second terminal hole formed so as to be separated from the third connection holes, the upper electrode block being electrically connected with the semiconductor laser element and being electrically insulated from the lower electrode block;
a heat sink having a pair of fourth connection holes communicating with the respective second connection holes, the lower electrode block being disposed on an upper surface of the heat sink; and
an optical component attached to the upper electrode block, the optical component being configured to receive the laser light from the semiconductor laser element,wherein the lower electrode block and the upper electrode block are fastened together with a pair of first fasteners inserted into the first and the third connection holes, andthe lower electrode block and the heat sink are fastened together with a pair of second fasteners inserted into the second and the fourth connection holes.
1 Assignment
0 Petitions
Accused Products
Abstract
Semiconductor laser device (1) includes lower electrode block (10) that has a first terminal hole and first and second connection holes, upper electrode block (60) that has third connection holes communicating with the respective first connection holes and a second terminal hole, heat sink (110) that has fourth connection holes communicating with the respective second connection holes, and optical component (100) attached to upper electrode block (60). The first and the second connection holes are formed on both side of a recess that is formed to house a submount on which a semiconductor laser element is disposed. Lower electrode block (10) is disposed on heat sink (110). Lower electrode block (10) and upper electrode block (60) are fastened together with first fasteners (90, 90), whereas lower electrode block (10) and heat sink (110) are fastened together with second fasteners (91, 91).
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Citations
8 Claims
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1. A semiconductor laser device comprising:
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a semiconductor laser element to emit laser light; a submount electrically connected with the semiconductor laser element disposed on an upper surface of the submount, the submount being made of a conductive material; a lower electrode block that is disposed below the submount and that is electrically connected with the submount, the lower electrode block having a submount disposition space to allow the submount to be disposed on an upper surface of the lower electrode block, the lower electrode block including at least a pair of first connection holes formed on both sides of the submount disposition space, a pair of second connection holes formed on both sides of the submount disposition space so as to be separated from the first connection holes, and a first terminal hole formed so as to be separated from the submount disposition space and the first and the second connection holes; an upper electrode block disposed over the lower electrode block so as to cover the submount and the semiconductor laser element, the upper electrode block including a pair of third connection holes communicating with the respective first connection holes, and a second terminal hole formed so as to be separated from the third connection holes, the upper electrode block being electrically connected with the semiconductor laser element and being electrically insulated from the lower electrode block; a heat sink having a pair of fourth connection holes communicating with the respective second connection holes, the lower electrode block being disposed on an upper surface of the heat sink; and an optical component attached to the upper electrode block, the optical component being configured to receive the laser light from the semiconductor laser element, wherein the lower electrode block and the upper electrode block are fastened together with a pair of first fasteners inserted into the first and the third connection holes, and the lower electrode block and the heat sink are fastened together with a pair of second fasteners inserted into the second and the fourth connection holes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification