SEMICONDUCTOR LASER DEVICE

• US 20200136343A1
• Filed: 12/24/2019
• Published: 04/30/2020
• Est. Priority Date: 07/07/2017
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: OOMORI, KOUJI, KASAI, TERUAKI
• Granted Patent: US 11,133,644 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 19/0014 at least one surface having optical power
• CPC Class Codes: G02B 19/0057 in the form of a laser diode array, e.g. laser diode bar semiconductor laser arrays with beam combining arrangement H01S5/4012
• CPC Class Codes: G02B 7/023 permitting adjustment
• CPC Class Codes: G02B 7/04 with mechanism for focusing or varying magnification
• CPC Class Codes: G11B 7/127 Lasers; Multiple laser arrays lasers per se H01S
• CPC Class Codes: H01L 23/40 Mountings or securing means for detachable cooling or heating arrangements heating H01L23/345; fixed by friction, plugs or springs
• CPC Class Codes: H01S 5/005 Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping H01S5/026, H01S5/18388 take precedence
• CPC Class Codes: H01S 5/02253 using lenses
• CPC Class Codes: H01S 5/02326 Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
• CPC Class Codes: H01S 5/02345 Wire-bonding
• CPC Class Codes: H01S 5/02355 Fixing laser chips on mounts
• CPC Class Codes: H01S 5/02365 by clamping
• CPC Class Codes: H01S 5/0237 by soldering
• CPC Class Codes: H01S 5/02469 Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
• CPC Class Codes: H01S 5/02476 Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
• CPC Class Codes: H01S 5/02492 CuW heat spreaders
• CPC Class Codes: H01S 5/04256 characterised by the configuration

Abstract

Semiconductor laser device (1) includes lower electrode block (10) that has a first terminal hole and first and second connection holes, upper electrode block (60) that has third connection holes communicating with the respective first connection holes and a second terminal hole, heat sink (110) that has fourth connection holes communicating with the respective second connection holes, and optical component (100) attached to upper electrode block (60). The first and the second connection holes are formed on both side of a recess that is formed to house a submount on which a semiconductor laser element is disposed. Lower electrode block (10) is disposed on heat sink (110). Lower electrode block (10) and upper electrode block (60) are fastened together with first fasteners (90, 90), whereas lower electrode block (10) and heat sink (110) are fastened together with second fasteners (91, 91).

Claims

1. A semiconductor laser device comprising:

a semiconductor laser element to emit laser light;

a submount electrically connected with the semiconductor laser element disposed on an upper surface of the submount, the submount being made of a conductive material;

a lower electrode block that is disposed below the submount and that is electrically connected with the submount, the lower electrode block having a submount disposition space to allow the submount to be disposed on an upper surface of the lower electrode block, the lower electrode block including

at least a pair of first connection holes formed on both sides of the submount disposition space,

a pair of second connection holes formed on both sides of the submount disposition space so as to be separated from the first connection holes, and

a first terminal hole formed so as to be separated from the submount disposition space and the first and the second connection holes;

an upper electrode block disposed over the lower electrode block so as to cover the submount and the semiconductor laser element, the upper electrode block including

a pair of third connection holes communicating with the respective first connection holes, and

a second terminal hole formed so as to be separated from the third connection holes, the upper electrode block being electrically connected with the semiconductor laser element and being electrically insulated from the lower electrode block;

a heat sink having a pair of fourth connection holes communicating with the respective second connection holes, the lower electrode block being disposed on an upper surface of the heat sink; and

an optical component attached to the upper electrode block, the optical component being configured to receive the laser light from the semiconductor laser element,

wherein the lower electrode block and the upper electrode block are fastened together with a pair of first fasteners inserted into the first and the third connection holes, and

the lower electrode block and the heat sink are fastened together with a pair of second fasteners inserted into the second and the fourth connection holes.

2. The semiconductor laser device according to claim 1, wherein each of the first fasteners is a screw made of an insulating material, and each of the first connection holes is a screw hole into which each of the first fasteners is screwed.

3. The semiconductor laser device according to claim 1, wherein

each of the second fasteners is a screw made of a metallic material, and each of the fourth connection holes is a screw hole into which each of the second fasteners is screwed, and

each of the second fasteners is electrically insulated from the lower electrode block with an insulating member.

4. The semiconductor laser device according to claim 1, further comprising a third fastener made of a conductive material,

wherein the third fastener is inserted into each of the first and the second terminal holes and is tightened to electrically connect external terminals used to supply electric power to the semiconductor laser element with the lower electrode block and the upper electrode block, respectively.

5. The semiconductor laser device according to claim 4, wherein the third fastener is a screw, and each of the first and the second terminal holes is a screw hole into which the third fastener is screwed.

6. The semiconductor laser device according to claim 5, including three of the first connection holes that are made up of the pair of the first connection holes formed at respective places on both sides of the submount disposition space and another first connection hole formed at a place on a side opposite to a side from which the laser light is emitted so as to be separated from the submount disposition space, wherein the first terminal hole is disposed in a vicinity of a barycenter of a triangle joining the three of the first connection holes in a top view.

7. The semiconductor laser device according to claim 1, wherein the submount disposition space is a cutout recess that is opened in a direction along which the laser light is emitted.

8. The semiconductor laser device according to claim 1, wherein a lower surface of the upper electrode block has a recess to house the submount and the semiconductor laser element.