MEMS Actuation Systems and Methods

• US 20200136527A1
• Filed: 12/30/2019
• Published: 04/30/2020
• Est. Priority Date: 09/12/2016
• Status: Active Grant

• Current Assignee: MEMS Drive, Inc.
• Original Assignee: MEMS Drive, Inc.
• Inventors: Ng, Matthew, Liu, Xiaolei, Wang, Guiqin
• Granted Patent: US 11,407,634 B2
• Time in Patent Office: Days
• CPC Class Codes: B81B 2201/033 Comb drives
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81B 2203/0145 Flexible holders
• CPC Class Codes: B81B 2203/051 Translation according to an axis parallel to the substrate
• CPC Class Codes: B81B 2203/053 Translation according to an axis perpendicular to the substrate
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81B 3/0062 Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
• CPC Class Codes: B81B 7/0016 Protection against shocks or vibrations, e.g. vibration damping
• CPC Class Codes: B81C 2203/032 Gluing
• CPC Class Codes: G02B 27/646 compensating for small deviations, e.g. due to vibration or shake movement of one or more optical elements for control of motion blur in cameras, projectors or printers G03B2205/0007; image stabilisation in cameras peculiar to the presence or use of an electronic image sensor H04N23/68
• CPC Class Codes: H02N 2/02 producing linear motion, e.g. actuators; Linear positioners ; Linear motors
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/58 Means for changing the camera field of view without moving the camera body, e.g. nutating or panning of optics or image sensors
• CPC Class Codes: H10N 30/2044 having multiple segments mechanically connected in series, e.g. zig-zag type

Abstract

A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

Claims

1. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:

mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate;

mounting an image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator; and

electrically coupling the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

2. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 1 wherein mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate includes:

applying epoxy to the metal plate;

positioning the micro-electrical-mechanical system (MEMS) actuator on the epoxy; and

curing the epoxy.

3. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 1 wherein mounting an image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator includes:

applying epoxy to the micro-electrical-mechanical system (MEMS) actuator;

positioning the image sensor on the epoxy; and

curing the epoxy.

4. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 1 wherein electrically coupling the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator includes:

wirebonding the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator.

5. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 1 further comprising:

mounting the micro-electrical-mechanical system (MEMS) subassembly to a printed circuit board.

6. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 5 wherein mounting the micro-electrical-mechanical system (MEMS) subassembly to a printed circuit board includes:

applying epoxy to the printed circuit board;

positioning the micro-electrical-mechanical system (MEMS) subassembly on the epoxy; and

curing the epoxy.

7. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 5 further comprising:

electrically coupling the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board.

8. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 7 wherein electrically coupling the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board includes:

wirebonding the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board.

9. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 8 wherein electrically coupling the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board further includes:

encapsulating the wirebonding in epoxy.

10. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 1 further comprising:

mounting a holder assembly to the micro-electrical-mechanical system (MEMS) subassembly.

11. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 10 wherein mounting a holder assembly to the micro-electrical-mechanical system (MEMS) subassembly includes:

applying epoxy to the printed circuit board;

positioning the holder assembly on the epoxy; and

curing the epoxy.

12. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:

mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate;

mounting an image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator;

electrically coupling the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly;

mounting the micro-electrical-mechanical system (MEMS) subassembly to a printed circuit board; and

electrically coupling the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board.

13. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 12 wherein mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate includes:

applying epoxy to the metal plate;

positioning the micro-electrical-mechanical system (MEMS) actuator on the epoxy; and

curing the epoxy.

14. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 12 wherein mounting an image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator includes:

applying epoxy to the micro-electrical-mechanical system (MEMS) actuator;

positioning the image sensor on the epoxy; and

curing the epoxy.

15. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 12 wherein electrically coupling the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator includes:

wirebonding the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator.

16. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 12 wherein mounting the micro-electrical-mechanical system (MEMS) subassembly to a printed circuit board includes:

applying epoxy to the printed circuit board;

positioning the micro-electrical-mechanical system (MEMS) subassembly on the epoxy; and

curing the epoxy.

17. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 12 wherein electrically coupling the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board includes:

wirebonding the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board; and

encapsulating the wirebonding in epoxy.

18. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 12 further comprising:

mounting a holder assembly to the micro-electrical-mechanical system (MEMS) subassembly.

19. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of claim 18 wherein mounting a holder assembly to the micro-electrical-mechanical system (MEMS) subassembly includes:

applying epoxy to the printed circuit board;

positioning the holder assembly on the epoxy; and

curing the epoxy.

20. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:

mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate;

mounting an image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator;

electrically coupling the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly;

mounting the micro-electrical-mechanical system (MEMS) subassembly to a printed circuit board;

electrically coupling the micro-electrical-mechanical system (MEMS) subassembly to the printed circuit board; and

mounting a holder assembly to the micro-electrical-mechanical system (MEMS) subassembly.