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PRINTED CIRCUIT BOARD AND POWER COPPER SURFACE CONFIGURATION METHOD THEREOF

  • US 20200137878A1
  • Filed: 10/22/2019
  • Published: 04/30/2020
  • Est. Priority Date: 10/26/2018
  • Status: Active Grant
First Claim
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1. A printed circuit board, comprising:

  • a first power supply component;

    a second power supply component;

    a power sink component;

    a first power copper surface portion, electrically connected to the first power supply component;

    a second power copper surface portion, electrically connected to the second power supply component;

    a third power copper surface portion, electrically connected to the power sink component;

    a convergence copper surface portion, electrically connected to the first power copper surface portion, the second power copper surface portion and the third power copper surface portion, wherein currents provided by the first power supply component and the second power supply component flow to the convergence copper surface portion via the first power copper surface portion and the second power copper surface portion, respectively and flow to the power sink component via the convergence copper surface portion;

    a first grounding copper surface portion, electrically connected to the first power supply component and the power sink component; and

    a second grounding copper surface portion, electrically connected to the second power supply component and the power sink component, wherein the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion conform to a current balancing design of the printed circuit board,wherein when a first sum of equivalent resistances of the first power copper surface portion and the first grounding copper surface portion and a second sum of equivalent resistances of the second power copper surface portion and the second grounding copper surface portion satisfy the following inequality , the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion confirm to the current balancing design;

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