PRINTED CIRCUIT BOARD AND POWER COPPER SURFACE CONFIGURATION METHOD THEREOF

• US 20200137878A1
• Filed: 10/22/2019
• Published: 04/30/2020
• Est. Priority Date: 10/26/2018
• Status: Active Grant

• Current Assignee: Pegatron Corporation
• Original Assignee: Pegatron Corporation
• Inventors: Hsieh, Yang-Chih, Chu, Cheng-Hui
• Granted Patent: US 10,701,794 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 2115/12 Printed circuit boards [PCB] or multi-chip modules [MCM]
• CPC Class Codes: G06F 2119/06 Power analysis or power optimisation
• CPC Class Codes: G06F 30/392 Floor-planning or layout, e.g. partitioning or placement
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/0265 characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/0784 Uniform resistance, i.e. equalizing the resistance of a number of conductors
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Abstract

A printed circuit board and a power copper surface configuration method are provided. The method includes the following steps: configuring a first power supply component, a second power supply component, a power sink component, a convergence copper surface portion, a first grounding copper surface portion and a second grounding copper surface portion; determining whether currents of the first and second power supply components flow to the power sink component through the convergence copper surface portion; when the currents of the first and second power supply components flow to the power sink component through the convergence copper surface portion, determining whether the convergence copper surface portion conforms to a current balancing design of the printed circuit board according to at least one of first and second tolerable difference values and an average current. When the convergence copper surface portion conforms to the current balancing design, the method is ended.

Claims

1. A printed circuit board, comprising:

a first power supply component;

a second power supply component;

a power sink component;

a first power copper surface portion, electrically connected to the first power supply component;

a second power copper surface portion, electrically connected to the second power supply component;

a third power copper surface portion, electrically connected to the power sink component;

a convergence copper surface portion, electrically connected to the first power copper surface portion, the second power copper surface portion and the third power copper surface portion, wherein currents provided by the first power supply component and the second power supply component flow to the convergence copper surface portion via the first power copper surface portion and the second power copper surface portion, respectively and flow to the power sink component via the convergence copper surface portion;

a first grounding copper surface portion, electrically connected to the first power supply component and the power sink component; and

a second grounding copper surface portion, electrically connected to the second power supply component and the power sink component, wherein the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion conform to a current balancing design of the printed circuit board,

wherein when a first sum of equivalent resistances of the first power copper surface portion and the first grounding copper surface portion and a second sum of equivalent resistances of the second power copper surface portion and the second grounding copper surface portion satisfy the following inequality , the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion confirm to the current balancing design;

2. The printed circuit board according to claim 1, wherein the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion conform to a layout design of the printed circuit board.

3. The printed circuit board according to claim 1, wherein when the first power supply component, the second power supply component and the power sink component are mounted by Dual In Line Package (DIP), the first power copper surface portion and the first power supply component are electrically connected on a first layer of printed circuit board;

the second power copper surface portion is electrically connected to the second power supply component on the first layer of printed circuit board;

the third power copper surface portion is electrically connected to the power sink component on a second layer of printed circuit board;

the convergence copper surface portion is electrically connected to the first power copper surface portion and the second power copper surface portion on the first layer of printed circuit board; and

the convergence copper surface portion is electrically connected to the third power copper surface portion through a plurality of via holes going through from the first layer of printed circuit board to the second layer of printed circuit board.

4. The printed circuit board according to claim 3, wherein the first grounding copper surface portion, the first power supply component, the second grounding copper surface portion, the second power supply component and the power sink component are electrically connected on a third layer of printed circuit board.

5. The printed circuit board according to claim 1, wherein when the first power supply component and the second power supply component are mounted by Dual In Line Package (DIP), and the power sink component is mounted by Surface Mount Technology (SMT), the first power copper surface portion is electrically connected to the first power supply component on a first layer of printed circuit board;

the second power copper surface portion is electrically connected to the second power supply component on the first layer of printed circuit board;

the third power copper surface portion located on a second layer of printed circuit board is electrically connected to the power sink component located on the first layer of printed circuit board through a plurality of first via holes going through from the first layer of printed circuit board to the second layer of printed circuit board;

the convergence copper surface portion is electrically connected to the first power copper surface portion and the second power copper surface portion on the first layer of printed circuit board; and

the convergence copper surface portion is electrically connected to the third power copper surface portion through a plurality of second via holes going through from the first layer of printed circuit board to the second layer of printed circuit board.

6. The printed circuit board according to claim 5, wherein the first grounding copper surface portion, the first power supply component, the second grounding copper surface portion and the second power supply component are electrically connected on a third layer of printed circuit board, and the first grounding copper surface portion and the second grounding copper surface portion are electrically connected to the power sink component through a plurality of third via holes going through from the first layer of printed circuit board to the third layer of printed circuit board.

7. The printed circuit board according to claim 1, wherein when the first power supply component, the second power supply component and the power sink component are mounted by SMT, the first power copper surface portion is electrically connected to the first power supply component on a first layer of printed circuit board;

the second power copper surface portion is electrically connected to the second power supply component on the first layer of printed circuit board;

the third power copper surface portion is electrically connected to the power sink component on the first layer of printed circuit board; and

the convergence copper surface portion, the first power copper surface portion, the second power copper surface portion and the third power copper surface portion are electrically connected on the first layer of printed circuit board.

8. The printed circuit board according to claim 1, wherein when the first power supply component, the second power supply component and the power sink component are mounted by SMT, each of the first power copper surface portion and the second power copper surface portion comprises a plurality of copper surfaces located on a first layer of printed circuit board and a second layer of printed circuit board and electrically connected with one another, and the third power copper surface portion comprises a plurality of copper surfaces located on the second layer of printed circuit board and a third layer of printed circuit board and electrically connected with one another;

the first power copper surface portion, the first power supply component, the second power copper surface portion and the second power supply component are electrically connected on the first layer of printed circuit board;

the convergence copper surface portion, the first power copper surface portion, the second power copper surface portion and the third power copper surface portion are electrically connected on the second layer of printed circuit board; and

the third power copper surface portion is electrically connected to the power sink component on the third layer of printed circuit board.

9. The printed circuit board according to claim 8, wherein each of the first grounding copper surface portion and the second grounding copper surface portion comprises a plurality of copper surfaces located on the first layer of printed circuit board, a fourth layer of printed circuit board and the third layer of printed circuit board and electrically connected with one another;

the first grounding copper surface portion is electrically connected to the first power supply component on the first layer of printed circuit board;

the first grounding copper surface portion is electrically connected to the power sink component on the third layer of printed circuit board;

the second grounding copper surface portion is electrically connected to the second power supply component on the first layer of printed circuit board; and

the second grounding copper surface portion is electrically connected to the power sink component on the third layer of printed circuit board.

10. The printed circuit board according to claim 1, wherein when the first power supply component, the second power supply component and the power sink component are mounted by DIP, each of the first power copper surface portion and the second power copper surface portion comprises a plurality of copper surfaces located on a first layer of printed circuit board, a second layer of printed circuit board and a third layer of printed circuit board and electrically connected with one another, and the third power copper surface portion comprises a plurality of copper surfaces located on the first layer of printed circuit board, the second layer of printed circuit board and the third layer of printed circuit board and electrically connected with one another;

the first power copper surface portion, the first power supply component, the second power copper surface portion and the second power supply component are electrically connected on the first layer of printed circuit board and the third layer of printed circuit board;

the convergence copper surface portion, the first power copper surface portion, the second power copper surface portion and the third power copper surface portion are electrically connected on the second layer of printed circuit board; and

the third power copper surface portion is electrically connected to the power sink component on the first layer of printed circuit board and the third layer of printed circuit board.

11. The printed circuit board according to claim 10, wherein each of the first grounding copper surface portion and the second grounding copper surface portion comprises a plurality of copper surfaces located on the second layer of printed circuit board, the third layer of printed circuit board and a fourth layer of printed circuit board and electrically connected with one another;

the first grounding copper surface portion is electrically connected to the first power supply component on the second layer of printed circuit board and the fourth layer of printed circuit board;

the first grounding copper surface portion is electrically connected to the power sink component on the second layer of printed circuit board and the fourth layer of printed circuit board;

the second grounding copper surface portion is electrically connected to the second power supply component on the second layer of printed circuit board and the fourth layer of printed circuit board; and

the second grounding copper surface portion is electrically connected to the power sink component on the second layer of printed circuit board and the fourth layer of printed circuit board.

12. A power copper surface configuration method of a printed circuit board, wherein the printed circuit board comprises a first power copper surface portion electrically connected to a first power supply component, a second power copper surface portion electrically connected to a second power supply component, a third power copper surface portion electrically connected to a power sink component, a first grounding copper surface portion electrically connected to the first power supply component and the power sink component, and a second grounding copper surface portion electrically connected to the second power supply component and the power sink component, and the power copper surface configuration method comprises:

configuring the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, a convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion;

determining whether a current of the first power supply component flows to the power sink component from the convergence copper surface portion, the convergence copper surface portion being electrically connected to the first power copper surface portion, the second power copper surface portion and the third power copper surface portion;

determining whether a current of the second power supply component flows to the power sink component from the convergence copper surface portion;

when the currents of the first power supply component and the second power supply component both flow to the power sink component via the convergence copper surface portion, determining whether the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion conform to a current balancing design of the printed circuit board according to at least one of a first tolerable difference value and a second tolerable difference value and an average current, wherein the first tolerable difference value corresponds to the current of the first power supply component, and the second tolerable difference value corresponds to the current of the second power supply component;

when the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion conform to the current balancing design of the printed circuit board, ending the power copper surface configuration method.

13. The power copper surface configuration method according to claim 12, further comprising:

when the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion do not conform to the current balancing design of the printed circuit board, performing at least one of the following steps;

reconfiguring the positions of the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion, and increasing the first tolerable difference value and the second tolerable difference value.

14. The power copper surface configuration method according to claim 12, wherein the step of determining whether the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion conform to the current balancing design of the printed circuit board according to at least one of the first tolerable difference value and the second tolerable difference value and the average current comprises:

calculating a first sum of equivalent resistances of the first power copper surface portion and the first grounding copper surface portion and a second sum of equivalent resistances of the second power copper surface portion and the second grounding copper surface portion;

determining whether a ratio of the first sum to the second sum conforms to a current balancing resistance ratio according to the following inequality;

15. The power copper surface configuration method according to claim 12, wherein the step of determining whether the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion conform to the current balancing design of the printed circuit board according to at least one of the first tolerable difference value and the second tolerable difference value and the average current comprises:

when an absolute value of a difference value between the current of the first power supply component and the average current is less than or equal to the first tolerable difference value, and an absolute value of a difference value between the current of the second power supply component and the average current is less than or equal to the second tolerable difference value, determining that the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion conform to the current balancing design of the printed circuit board; and

when the absolute value of the difference value between the current of the first power supply component and the average current is greater than the first tolerable difference value, or the absolute value of the difference value between the current of the second power supply component and the average current is greater than the second tolerable difference value, determining that the first power supply component, the second power supply component, the power sink component, the first power copper surface portion, the second power copper surface portion, the third power copper surface portion, the convergence copper surface portion, the first grounding copper surface portion and the second grounding copper surface portion do not conform to the current balancing design of the printed circuit board.