CHIP PACKAGE AND POWER MODULE
First Claim
1. A chip package, comprising:
- a high voltage withstanding substrate having a main body, a functional layer and a grounding layer, the main body having a top surface and a bottom surface opposite the top surface, a through hole through the top surface and the bottom surface, and a sidewall surrounding the through hole, wherein the function layer is located on the top surface, and the grounding layer covers the bottom surface and the sidewall; and
a device chip located on the functional layer, and having a grounding pad that faces the main body, wherein the grounding pad is electrically connected to the grounding layer in the through hole.
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Accused Products
Abstract
A chip package includes a high voltage withstanding substrate and a device chip. The high voltage withstanding substrate has a main body, a functional layer, and a grounding layer. The main body has a top surface, a bottom surface opposite the top surface, a through hole through the top surface and the bottom surface, and a sidewall surrounding the through hole. The functional layer is located on the top surface. The grounding layer covers the bottom surface and the sidewall. The device chip is located on the functional layer, and has a grounding pad that faces the main body. The grounding pad is electrically connected to the grounding layer in the through hole.
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Citations
16 Claims
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1. A chip package, comprising:
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a high voltage withstanding substrate having a main body, a functional layer and a grounding layer, the main body having a top surface and a bottom surface opposite the top surface, a through hole through the top surface and the bottom surface, and a sidewall surrounding the through hole, wherein the function layer is located on the top surface, and the grounding layer covers the bottom surface and the sidewall; and a device chip located on the functional layer, and having a grounding pad that faces the main body, wherein the grounding pad is electrically connected to the grounding layer in the through hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A power module, comprising:
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a printed circuit board having a grounding region; and a chip package located on the grounding region of the printed circuit board, comprising; a high voltage withstanding substrate having a main body, a functional layer, and a grounding layer, the main body having a top surface and a bottom surface opposite the top surface, a through hole through the top surface and the bottom surface, and a sidewall surrounding the through hole, wherein the function layer is located on the top surface, the grounding layer covers the bottom surface and the sidewall, and the grounding layer is located on the grounding region of the printed circuit board and is electrically connected to the grounding region; and a device chip located on the functional layer, and having a grounding pad facing the main body, wherein the grounding pad is electrically connected to the grounding layer in the through hole. - View Dependent Claims (14, 15, 16)
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Specification