APPARATUS AND SYSTEM OF A PRINTED CIRCUIT BOARD (PCB) INCLUDING A RADIO FREQUENCY (RF) TRANSITION

• US 20200137884A1
• Filed: 12/27/2019
• Published: 04/30/2020
• Est. Priority Date: 12/27/2019
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Markish, Ofer, Dalmia, Sidharth, Amadjikpe, Arnaud
• Granted Patent: US 11,596,055 B2
• Time in Patent Office: Days
• CPC Class Codes: G01S 13/931 of land vehicles
• CPC Class Codes: G01S 7/028 Miniaturisation, e.g. surface mounted device [SMD] packaging or housings
• CPC Class Codes: G01S 7/032 Constructional details for solid-state radar subsystems
• CPC Class Codes: H01Q 21/0006 Particular feeding systems
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/0242 Structural details of individual signal conductors, e.g. related to the skin effect
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/09536 Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2201/09609 Via grid, i.e. two-dimensional array of vias or holes in a single plane interposers H05K2201/10378
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09809 Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array

Abstract

For example, an apparatus may include a Printed Circuit Board (PCB) including a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect a Surface Mounted Device (SMD) to the PCB; an antenna disposed on a second side of the PCB opposite to the first side, the antenna to communicate a Radio Frequency (RF) signal of the SMD; and an RF transition to transit the RF signal between the BGA and the antenna, the RF transition including a plurality of signal buried-vias; a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna.

Claims

1. An apparatus comprising a Printed Circuit Board (PCB), the PCB comprising:

a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect a Surface Mounted Device (SMD) to the PCB;

an antenna disposed on a second side of the PCB opposite to the first side, the antenna to communicate a Radio Frequency (RF) signal of the SMD; and

an RF transition to transit the RF signal between the BGA and the antenna, the RF transition comprising;

a plurality of signal buried-vias;

a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and

a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna, the second plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias.

2. The apparatus of claim 1, wherein the RF transition comprises a first buried-via connection layer and a second buried-via connection layer, the first buried-via connection layer to connect the first plurality of microvias to first ends of the plurality of signal buried-vias, the second buried-via connection layer to connect the second plurality of microvias to second ends of the plurality of signal buried-vias.

3. The apparatus of claim 2, wherein a surface of the first buried-via connection layer is connected to the first plurality of microvias in a planar manner, and wherein a surface of the second buried-via connection layer is connected to the second plurality of microvias in a planar manner.

4. The apparatus of claim 1, wherein the RF transition comprises a first microvia connection layer and a second microvia connection layer, the first microvia connection layer to connect the first plurality of microvias to the ball of the BGA, and the second microvia connection layer to connect the second plurality of microvias to the antenna.

5. The apparatus of claim 1, wherein the plurality of signal buried-vias are arranged in a first ring, the first plurality of microvias are arranged in a second ring concentric with the first ring, and the second plurality of microvias are arranged in a third ring concentric with the first ring.

6. The apparatus of claim 5, wherein the ball of the BGA is disposed on an axis of the first ring.

7. The apparatus of claim 1, wherein each microvia of the first plurality of microvias is rotationally misaligned with each of the plurality of signal buried-vias, and wherein each microvia of the second plurality of microvias is rotationally misaligned with each of the plurality of signal buried-vias.

8. The apparatus of claim 1, wherein the RF transition comprises:

a plurality of peripheral buried-vias around the plurality of signal buried-vias;

a first plurality of staggered microvias to connect between the plurality of the peripheral buried-vias and a plurality of balls of the BGA around the ball of the BGA, the first plurality of staggered microvias are staggered with respect to the plurality of peripheral buried-vias; and

a second plurality of staggered microvias to ground the plurality of the peripheral buried-vias, the second plurality of staggered microvias are staggered with respect to the plurality of peripheral buried-vias.

9. The apparatus of claim 1, wherein the RF transition comprises:

a first plurality of microvia sections configured to transit the RF signal between the ball of the BGA and the plurality of signal buried-vias via a plurality of first layers of the PCB; and

a second plurality of microvia sections configured to transit the RF signal between the plurality of signal buried-vias and the antenna via a plurality of second layers of the PCB.

10. The apparatus of claim 1, wherein the plurality of buried-vias comprises at least three buried-vias, the first plurality of microvias comprises at least three microvias, and the second plurality of microvias comprises at least three microvias.

11. The apparatus of claim 1, wherein the RF signal comprises an RF signal in a frequency band above 30 Gigahertz (GHz).

12. The apparatus of claim 1, wherein the RF signal comprises an RF signal in a frequency band between 76 GHz and 81 GHz.

13. The apparatus of claim 1, wherein the RF signal comprises a radar signal.

14. The apparatus of claim 1, wherein the RF signal comprises a wireless communication signal.

15. The apparatus of claim 1, wherein the PCB comprises:

a plurality of Transmit (Tx) antennas;

a first plurality of RF transitions configured to transit a plurality of Tx signals from the BGA to the plurality of Tx antennas;

a plurality of Receive (Rx) antennas; and

a second plurality of RF transitions configured to transit a plurality of Rx signals from the plurality of Rx antennas to the BGA.

16. The apparatus of claim 1 comprising the SMD, and a processor configured to process information corresponding to the RF signal.

17. The apparatus of claim 16 comprising an underfill layer between the SMD and the PCB.

18. A radar device comprising:

a Printed Circuit Board (PCB);

a Surface Mounted Device (SMD) to process communication of radar signals;

a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect the SMD to the PCB;

a plurality of Transmit (Tx) antennas disposed on a second side of the PCB opposite to the first side;

a plurality of Receive (Rx) antennas disposed on the second side of the PCB;

a first plurality of Radio Frequency (RF) transitions to transit a plurality of Tx signals from the BGA to the plurality of Tx antennas; and

a second plurality of RF transitions to transit a plurality of Rx signals from the plurality of Rx antennas to the BGA,

wherein an RF transition of the first and second pluralities of RF transitions is configured to transit an RF signal between the BGA and an antenna of the plurality of Tx antennas or the plurality of Rx antennas, the RF transition comprising;

a plurality of signal buried-vias;

a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and

a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna, the second plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias.

19. The radar device of claim 18, wherein the RF transition comprises a first buried-via connection layer and a second buried-via connection layer, the first buried-via connection layer to connect the first plurality of microvias to first ends of the plurality of signal buried-vias, the second buried-via connection layer to connect the second plurality of microvias to second ends of the plurality of signal buried-vias.

20. The radar device of claim 18, wherein the RF transition comprises a first microvia connection layer and a second microvia connection layer, the first microvia connection layer to connect the first plurality of microvias to the ball of the BGA, and the second microvia connection layer to connect the second plurality of microvias to the antenna.

21. The radar device of claim 18, wherein the plurality of signal buried-vias are arranged in a first ring, the first plurality of microvias are arranged in a second ring concentric with the first ring, and the second plurality of microvias are arranged in a third ring concentric with the first ring.

22. The radar device of claim 18, wherein the RF transition comprises:

a plurality of peripheral buried-vias around the plurality of signal buried-vias;

a first plurality of staggered microvias to connect between the plurality of the peripheral buried-vias and a plurality of balls of the BGA around the ball of the BGA, the first plurality of staggered microvias are staggered with respect to the plurality of peripheral buried-vias; and

a second plurality of staggered microvias to ground the plurality of the peripheral buried-vias, the second plurality of staggered microvias are staggered with respect to the plurality of peripheral buried-vias.

23. A vehicle comprising:

a system controller configured to control one or more vehicular systems of the vehicle based on radar information; and

a radar device configured to provide the radar information to the system controller, the radar device comprising;

a radar processor configured to provide the radar information based on radar signals;

a Surface Mounted Device (SMD) to process communication of the radar signals;

a Printed Circuit Board (PCB);

a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect the SMD to the PCB;

a plurality of Transmit (Tx) antennas disposed on a second side of the PCB opposite to the first side;

a plurality of Receive (Rx) antennas disposed on the second side of the PCB;

a first plurality of Radio Frequency (RF) transitions to transit a plurality of Tx signals from the BGA to the plurality of Tx antennas; and

a second plurality of RF transitions to transit a plurality of Rx signals from the plurality of Rx antennas to the BGA,

wherein an RF transition of the first and second pluralities of RF transitions is configured to transit an RF signal between the BGA and an antenna of the plurality of Tx antennas or the plurality of Rx antennas, the RF transition comprising;

a plurality of signal buried-vias;

a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and

a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna, the second plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias.

24. The vehicle of claim 23, wherein the RF transition comprises a first buried-via connection layer and a second buried-via connection layer, the first buried-via connection layer to connect the first plurality of microvias to first ends of the plurality of signal buried-vias, the second buried-via connection layer to connect the second plurality of microvias to second ends of the plurality of signal buried-vias.

25. The vehicle of claim 23, wherein the plurality of signal buried-vias are arranged in a first ring, the first plurality of microvias are arranged in a second ring concentric with the first ring, and the second plurality of microvias are arranged in a third ring concentric with the first ring.