MICROFLUIDIC CHANNELS AND PUMPS FOR ACTIVE COOLING OF CIRCUIT BOARDS
1 Assignment
0 Petitions
Accused Products
Abstract
Microfluidic channels and pumps for active cooling of circuit boards are described. One circuit board includes a substrate and a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising liquid metal disposed in a microfluidic channel. Liquid metal is disposed in the microfluidic channel and a pump pumps the liquid metal through the microfluidic channel to actively cool at least a portion of the circuit board.
3 Citations
31 Claims
-
1-5. -5. (canceled)
-
6. A circuit board comprising:
-
a substrate; a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising liquid metal disposed in a microfluidic channel; and a pump coupled to the microfluidic channel structure, wherein the pump is to pump the liquid metal through the microfluidic channel to actively cool at least a portion of the circuit board, wherein the microfluidic channel structure is disposed in a ground plane of the circuit board. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 30)
-
-
16-20. -20. (canceled)
-
21. An apparatus comprising:
-
a circuit board comprising; a substrate; a component disposed at a first location; and a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising a microfluidic channel formed in at least one of polymeric organosilicon material or thermoplastic polymer material; and a pump coupled to the microfluidic channel structure, wherein the pump is to pump liquid metal through the microfluidic channel, wherein the liquid metal, when pumped through the microfluidic channel during operation of the component, transfers heat originating from the component at the first location through the microfluidic channel structure to a second location of the circuit board, wherein the microfluidic channel structure is disposed in a ground plane of the circuit board. - View Dependent Claims (23, 24, 25, 26)
-
-
22. (canceled)
-
27. An apparatus comprising:
-
a circuit board comprising; a substrate; a component disposed at a first location; and a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising Polydimethylsiloxane (PDMS) and Poly(methyl methacrylate) (PMMA), wherein a microfluidic channel is formed in PMMA; and a ground plane disposed on a first side of the substrate, wherein the microfluidic channel structure is disposed on a second side of the substrate; and a via disposed between the ground plane on the first side of the substrate and the microfluidic channel structure on the second side of the substrate; and a pump coupled to the microfluidic channel structure to move liquid metal through the microfluidic channel, wherein the liquid metal, when pumped through the microfluidic channel during operation of the component, transfers heat originating from the component at the first location through the microfluidic channel structure away from the component at the first location.
-
-
28. (canceled)
-
29. A circuit board comprising:
-
a substrate a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising Polydimethylsiloxane (PDMS) and Poly(methyl methacrylate) (PMMA), wherein a microfluidic channel is formed in PMMA; and a pump coupled to the microfluidic channel structure to move liquid metal through the microfluidic channel to transfer heat away from at least a first portion of the circuit board, wherein the microfluidic channel structure comprises; a first PMMA layer; a second PDMS layer; and a third PMMA layer. - View Dependent Claims (31)
-
Specification