PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

• US 20200137888A1
• Filed: 01/09/2019
• Published: 04/30/2020
• Est. Priority Date: 10/24/2018
• Status: Active Application

• Current Assignee: Avary Holding (Shenzhen) Co., Limited., Hongqisheng Precision Electronics Company Limited (Monterey Park Finance Limited)
• Original Assignee: Avary Holding (Shenzhen) Co., Limited., Hongqisheng Precision Electronics Company Limited (Monterey Park Finance Limited)
• Inventors: LIU, RUI-WU, HO, MING-JAAN, ZHOU, LEI, PENG, MAN-ZHI
• Granted Patent: US 10,849,229 B2
• Time in Patent Office: Days
• CPC Class Codes: H05K 1/0281 Reinforcement details thereof
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/047 Box-like arrangements of PCBs
• CPC Class Codes: H05K 2203/072 Electroless plating, e.g. finish plating or initial plating
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/24 Reinforcing the conductive pattern by solder coating H05K3/3457
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

Claims

1. A printed circuit board comprising:

a first circuit board unit;

a second circuit board unit;

at least two reinforcing plates, each of the reinforcing plates comprising a supporting portion, a first connecting portion and a second connecting portion; and

at least two connecting plates, each of the connecting plates attached to the supporting portion, the first connecting portion and the second connecting portion of one of the reinforcing plates;

wherein the first circuit board unit is fixed and electrically connected to a side of each of the connecting plates away from first connecting portion, the second circuit board unit is fixed and electrically connected to a side of each of the connecting plates away from the second connecting portion.

2. The printed circuit board of claim 1, wherein each of the connecting plates is a bendable flexible circuit board.

3. The printed circuit board of claim 1, wherein the reinforcing plate is in a shape of an “

E”

without the middle stroke.

4. The printed circuit board of claim 1, wherein the connecting plate comprises a base layer, a wiring layer and a cover layer, the wiring layer is pressed on the base layer, the cover layer covers the wiring layer, and the cover layer defines a window to expose portions of the wiring layer adjacent to two side edges of the wiring layer, the portions of the wiring layer adjacent to two side edges of the wiring layer which are exposed are electrically connected to the first circuit board unit and the second circuit board unit, respectively.

5. The printed circuit board of claim 4, wherein the cover layer comprises an adhesive layer and a base film, a first side of the wiring layer is attached to the base film through the adhesive layer, a second side opposite to the first side of the wiring layer is pressed against the base layer.

6. The printed circuit board of claim 4, wherein the wiring layer includes a line pattern, the cover layer covers the line pattern, two ends of the line pattern are partly exposed through the window to form the portions of the wiring layer which is exposed, the line pattern which is exposed is surface-treated to form a protection layer, the protection layer is electrically conducted to the line pattern, the protection layer is electrically conducted to the first circuit board unit and the second circuit board.

7. The printed circuit board of claim 4, wherein the adhesive layer is made of viscous resin.

8. The printed circuit board of claim 1, wherein the printed circuit board comprises two reinforcing plates, the two reinforcing plates are oppositely disposed between the first circuit board unit and the second circuit board unit.

9. The printed circuit board of claim 1, wherein the printed circuit board comprises four reinforcing plates, each of the four reinforcing plates is disposed around a side of the first circuit board unit and a corresponding side of the second circuit board unit.

10. The printed circuit board of claim 1, wherein an angle between the first connecting portion and the supporting portion is between 85°

and 95°

.

11. The printed circuit board of claim 1, wherein an angle between the second connecting portion and the supporting portion is between 85°

and 95°

.

12. The printed circuit board of claim 1, wherein the reinforcing plate is made of conductive material.

13. A method for manufacturing a printed circuit board comprising:

a first circuit board unit;

a second circuit board unit;

providing at least two reinforcing plates, each of the reinforcing plates comprising a supporting portion, a first connecting portion and a second connecting portion; and

providing at least two connecting plates, each of the connecting plates attached to the supporting portion, the first connecting portion and the second connecting portion of one of the reinforcing plates;

providing a first circuit board unit, the first circuit board unit fixed and electrically connected to a side of each of the connecting plates away from first connecting portion; and

providing a second circuit board unit, the second circuit board unit fixed and electrically connected to a side of each of the connecting plates away from the second connecting portion.

14. The method of claim 13, wherein the first circuit board unit is electrically connected to the connection board by solder paste.

15. The method of claim 13, wherein the first circuit board unit is electrically connected to the connection board by anisotropic conductive adhesive.

16. The method of claim 13, wherein a process for making a connecting plate comprises:

providing a copper clad unit, the copper clad unit comprising a base layer and a copper foil layer;

performing line patterning on the copper foil layer to form a line pattern to obtain a wiring layer;

providing a cover layer disposed on the wiring layer to cover the line pattern, the cover layer defining a window to expose a portion of two ends of the line pattern to form an exposed portion; and

performing surface treatment on the exposed portion to enable the exposed portion to electrically connect to an external structure.

17. The method of claim 16, wherein the window is formed by die punching.

18. The method of claim 16, wherein the surface treatment on the exposed portion is performed by electroless nickel immersion gold, oxidation prevention or electroless nickel electroless palladium immersion gold.

19. The method of claim 13, wherein each of the connecting plates is a bendable flexible circuit board.

20. The method of claim 13, wherein the reinforcing plate is in a shape of an “

E”

without the middle stroke.