HIGH FREQUENCY MODULE

• US 20200137893A1
• Filed: 12/27/2019
• Published: 04/30/2020
• Est. Priority Date: 06/29/2017
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: NOMURA, Tadashi, MORIMOTO, Yuta, KOMIYAMA, Minoru, KATSUBE, Akio
• Granted Patent: US 11,178,778 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 23/00 Details of semiconductor or other solid state devices H01L25/00 takes precedence ; structural arrangements for testing or measuring during manufacture or treatment, or for reliability measurements H01L22/00; arrangements for connecting or disconnecting semiconductor or solid-state bodies, or methods related thereto H01L24/00; finger print sensors G06V40/12
• CPC Class Codes: H01L 23/28 Encapsulations, e.g. encapsulating layers, coatings, e.g. for protectionH01L23/552 takes precedence; insulating layers for contacts or interconnections H01L23/5329
• CPC Class Codes: H01L 25/04 the devices not having separate containers
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/421 Blind plated via connections H05K3/422, H05K3/423 and H05K3/425 take precedence
• CPC Class Codes: H05K 9/00 Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00

Abstract

A high frequency module 1a includes a wiring board 2, multiple components 3a to 3d mounted on an upper surface 2a of the wiring board 2, a shield component 4 mounted between the component 3b and the component 3c, a sealing resin layer 5 that covers the components 3a to 3d and the shield component 4, and a shield film 6 that covers the surface of the sealing resin layer. A recess 10 is formed in an upper surface 5a of the sealing resin layer 5 so as to expose the shield component 4. The recess 10 is formed within a region surrounded by edges of the sealing resin layer 5 so as not to reach the side surfaces of the sealing resin layer 5. The shield film 6 further covers wall surfaces 10a of the recess 10 and part of the shield component 4 exposed through the recess 10.

Claims

1. A high frequency module comprising:

a wiring board;

a first component and a second component, wherein the first component and the second component are mounted on a major surface of the wiring board;

one or more electroconductive members mounted on the major surface of the wiring board at a position between the first component and the second component;

a sealing resin layer having a contact surface being in contact with the wiring board, an opposite surface being opposite to the contact surface, and side surfaces connecting edges of the contact surface to corresponding edges of the opposite surface, the sealing resin layer covering the wiring board, the first component, the second component, and the electroconductive member; and

a shield film covering at least the opposite surface and the side surfaces of the sealing resin layer, wherein

the electroconductive member is a conductor by itself or has a tabular conductor having one surface facing the first component and another surface facing the second component,

a recess is provided from the opposite surface of the sealing resin layer to the electroconductive member so as to expose a part of the electroconductive member, the recess being provided inside the sealing resin layer and not reaching the side surfaces of the sealing resin layer, and

the shield film further covers a wall surface of the recess and the exposed part of the electroconductive member.

2. The high frequency module according to claim 1, further comprising

a magnetic film provided between the sealing resin layer and the shield film.

3. The high frequency module according to claim 1, further comprising

a magnetic film provided to cover the shield film.

4. The high frequency module according to claim 2, wherein

the magnetic film is also provided on the wall surface of the recess.

5. The high frequency module according to claim 1, wherein

the one or more electroconductive members comprise a plurality of electroconductive members, and

the recess is provided at a position corresponding to each one of the plurality of electroconductive members.

6. The high frequency module according to claim 1, wherein

the one or more electroconductive members comprise a plurality of electroconductive members, and

the recess has

a single closed-bottom portion provided to a depth at which the plurality of electroconductive members are not exposed and

a plurality of through-hole portions provided in a bottom of the closed-bottom portion and through which respective ones of the plurality of electroconductive members are exposed.

7. The high frequency module according to claim 1, wherein

the one or more electroconductive members comprise a plurality of electroconductive members, and

the recess is a single recess through which all of the plurality of electroconductive members are exposed.

8. The high frequency module according to claim 1, wherein

the recess is shaped to expand in a direction from the contact surface toward the opposite surface of the sealing resin layer.

9. The high frequency module according to claim 3, wherein

the magnetic film is also provided on the wall surface of the recess.

10. The high frequency module according to claim 2, wherein

the recess is shaped to expand in a direction from the contact surface toward the opposite surface of the sealing resin layer.

11. The high frequency module according to claim 3, wherein

the recess is shaped to expand in a direction from the contact surface toward the opposite surface of the sealing resin layer.

12. The high frequency module according to claim 4, wherein

the recess is shaped to expand in a direction from the contact surface toward the opposite surface of the sealing resin layer.

13. The high frequency module according to claim 5, wherein

the recess is shaped to expand in a direction from the contact surface toward the opposite surface of the sealing resin layer.

14. The high frequency module according to claim 6, wherein

the recess is shaped to expand in a direction from the contact surface toward the opposite surface of the sealing resin layer.

15. The high frequency module according to claim 7, wherein

the recess is shaped to expand in a direction from the contact surface toward the opposite surface of the sealing resin layer.