METHOD OF MANUFACTURING CIRCUIT BOARD

• US 20200137894A1
• Filed: 12/19/2018
• Published: 04/30/2020
• Est. Priority Date: 10/30/2018
• Status: Active Grant

• Current Assignee: Avary Holding (Shenzhen) Co., Limited., Qing Ding Precision Electronics (Huaian) Co.,Ltd.
• Original Assignee: Avary Holding (Shenzhen) Co., Limited., Qing Ding Precision Electronics (Huaian) Co.,Ltd.
• Inventors: SHEN, FU-YUN, HO, MING-JAAN, HSU, HSIAO-TING, GAO, LIN-JIE
• Granted Patent: US 11,457,532 B2
• Time in Patent Office: Days
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 3/0094 Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: H05K 3/4617 characterized by laminating only or mainly similar single-sided circuit boards
• CPC Class Codes: H05K 3/462 characterized by laminating only or mainly similar double-sided circuit boards
• CPC Class Codes: H05K 3/4623 the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence
• CPC Class Codes: H05K 3/4661 Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor other insulating materials H05K3/387
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Claims

1. A method for manufacturing a circuit board comprising:

providing a single-sided board comprising a first insulating base, a copper layer covering a surface of the first insulating base, at least one first through hole each passing through the first insulating base to expose the copper layer, and at least one first conductive structure each infilled in one of the at least one first through hole;

forming at least one middle structure, each of the middle structure being formed by;

providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base arranged in that sequence;

forming a wiring layer by the metal layer, the wiring layer comprising at least one signal wire and at least one connecting pad;

defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base to expose one of the at least one connecting pad; and

forming a second conductive structure infilled in each of the at least one second through hole;

providing a double-sided board comprising a wiring layer, a fourth insulating base, and a first copper foil arranged in that sequence, the wiring layer of the double-sided board comprising at least one signal wire and at least one connecting pad, the double-sided board further comprising at least one third conductive structure each connecting one of the at least one connecting pad and the first copper foil; and

pressing the single-sided board, the at least one middle structure, and the double-sided board in that sequence to form the circuit board;

wherein each of the at least one first conductive structure connects one of the at least one connecting pad of an adjacent one of the middle structure, each of the at least one connecting pad of the double-sided board connects one second conductive structure of the adjacent middle structure;

when the circuit board comprises at least two middle structures, the two adjacent middle structures connect with each other by connecting the second conductive structure of one of the middle structures with the corresponding connecting pad of the adjacent middle structure.

2. The method for manufacturing a circuit board of claim 1, wherein each of the wiring layer in the laminated board and in the double-sided board comprises at least one signal wire and at least two connecting pads, the at least one signal wire being located between the at least two connecting pads of each wiring layer.

3. The method for manufacturing a circuit board of claim 1, providing the single-sided board further comprises:

providing a single-sided copper clad laminate comprising a first insulating base and a copper layer covering a surface of the first insulating base;

pressing an insulating removable layer on a surface of the first insulating base facing away from the copper layer, and defining at least one first through hole each passing through the insulating removable layer and the first insulating base to expose the copper layer; and

forming a first conductive structure in each of the at least one first through hole by infilling in the at least one first through hole with a conductive material, and removing the insulating removable layer, thereby obtaining the single-sided board;

wherein an end portion of each first conductive structure connects the copper layer, another end portion of each first conductive structure protrudes from a surface of the first insulating base facing away from the copper layer.

4. The method for manufacturing a circuit board of claim 1, providing the double-sided board further comprising:

providing a double-sided copper clad laminate comprising the first copper foil, the fourth insulating base, and a second copper foil arranged in that sequence;

forming a wiring layer by the second copper foil, the wiring layer comprising the at least one signal wire and the at least one connecting pad; and

defining at least one third through hole passing through the fourth insulating base wherein the first copper foil communicates with one of the at least one connecting pad of the double-sided copper clad laminate, and forming the third conductive structure in each of the at least one third through hole to connect the first copper foil to one of the at least one connecting pad of the double-sided copper clad laminate.

5. The method for manufacturing a circuit board of claim 1, providing the laminated board further comprising:

providing the second insulating base, and roughening a surface of the second insulating base;

forming a seed layer on the roughened surface;

forming a metal thickening layer on a surface of the seed layer facing away from the second insulating base, the seed layer and the metal thickening layer forming the metal shielding layer;

forming the third insulating base on a surface of the metal shielding layer facing away from the second insulating base; and

forming a metal layer on a surface of the third insulating base facing away from the metal shielding layer, thereby obtaining the laminated board.

6. The method for manufacturing a circuit board of claim 1, forming the at least one middle structure further comprising:

before defining the second through hole, pressing an insulating removable layer on a surface of the second insulating base facing away from the metal shielding layer;

defining the second through hole further passing through the insulating removable layer on the second insulating base; and

after forming the second conductive structure, removing the insulating removable layer on the second insulating base wherein the second conductive structure protrudes from a surface of the second insulating base facing away from the metal shielding layer.

7. A method for manufacturing a circuit board comprising:

providing a single-sided board comprising a first insulating base, a copper layer covering a surface of the first insulating base, at least one first through hole each passing through the first insulating base to expose the copper layer, and at least one first conductive structure each infilled in one of the at least one first through hole;

forming a middle body by;

providing a laminated structure comprising a metal layer, a third insulating base, a metal shielding layer, a second insulating base, and another metal layer arranged in that sequence;

forming a wiring layer by each metal layer, each wiring layer comprising at least one signal wire and at least one connecting pad;

defining at least one connecting hole each passing through the connecting pad of the laminated structure, the second insulating base, the metal shielding layer, and the third insulating base, to communicate two connecting pads of two wiring layers of the laminated structure with each other; and

forming an electrical connecting structure infilled in each of the at least one connecting hole;

pressing the single-sided board, the middle body, and another the single-sided board in that sequence to form the circuit board;

wherein the connecting pads of two wiring layers of the middle body connect the at least one first conductive structure of one single-sided board respectively.

8. The method for manufacturing a circuit board of claim 7, providing the laminated structure further comprises:

providing the second insulating base, and roughening a surface of the second insulating base;

forming a seed layer on the roughened surface;

forming a metal thickening layer on a surface of the seed layer facing away from the second insulating base, wherein the seed layer and the metal thickening layer form the metal shielding layer;

forming the third insulating base on a surface of the metal shielding layer facing away from the second insulating base; and

forming a metal layer on a surface of the third insulating base facing away from the metal shielding layer, and forming another metal layer on a surface of the second insulating base facing away from the metal shielding layer, thereby obtaining the laminated structure.

9. The method for manufacturing a circuit board of claim 7, wherein before pressing to form the circuit board, the method further comprising a step of providing a middle structure, the middle structure is formed by the following steps:

providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base arranged in that sequence;

forming a wiring layer by the metal layer of the laminated board, the wiring layer of the laminated board comprising at least one signal wire and at least one connecting pad;

defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base of the laminated board to expose the at least one connecting pad of the laminated board; and

forming a second conductive structure infilled in each of the at least one second through hole of the laminated board, thereby obtaining the middle structure;

wherein when pressing to form the circuit board, the middle body and at least one the middle structure are sandwiched between two single-sided boards and pressed to form the circuit board, each connecting pad connects one of the at least one first conductive structure, one electrical connecting structure or one second conductive structure.

10. The method for manufacturing a circuit board of claim 9, wherein the laminated board is made by the same way as the laminated structure.

11. The method for manufacturing a circuit board of claim 9, wherein at least one the middle structure is sandwiched between the middle body and one of the two single-sided boards.

12. The method for manufacturing a circuit board of claim 9, wherein at least one the middle structure is sandwiched between the middle body and each of the two single-sided boards.

13. The method for manufacturing a circuit board of claim 9, wherein each wiring layer comprises at least one signal wire and at least two connecting pads, the at least one signal wire of each wiring layer is located between the at least two connecting pads of the corresponding wiring layer.

14. The method for manufacturing a circuit board of claim 9, forming the middle structure further comprising:

before defining the second through hole, pressing an insulating removable layer on a surface of the second insulating base facing away from the metal shielding layer,

defining the second through hole further passing through the insulating removable layer on the second insulating base,

after forming the second conductive structure, removing the insulating removable layer on the second insulating base, wherein the second conductive structure protrudes from a surface of the second insulating base facing away from the metal shielding layer.

15. The method for manufacturing a circuit board of claim 7, providing the single-sided board further comprises:

providing a single-sided copper clad laminate comprising a first insulating base and a copper layer covering a surface of the first insulating base;

pressing an insulating removable layer on a surface of the first insulating base facing away from the copper layer, and defining at least one first through hole each passing through the insulating removable layer and the first insulating base to expose the copper layer; and

forming a first conductive structure in each of the at least one first through hole by infilling in the at least one first through hole with a conductive material, and removing the insulating removable layer, thereby obtaining the single-sided board;

wherein an end portion of each of the first conductive structure connects the copper layer, another end portion of each of the first conductive structure protrudes from a surface of the first insulating base facing away from the copper layer.