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CIRCUIT CARRIER AND MANIFACTURING METHOD THEREOF

  • US 20200137895A1
  • Filed: 12/13/2018
  • Published: 04/30/2020
  • Est. Priority Date: 10/30/2018
  • Status: Active Grant
First Claim
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1. A circuit carrier, comprising:

  • at least one flexible structure, comprising;

    a first dielectric layer; and

    a conductive pattern, disposed on a surface of the first dielectric layer; and

    a circuit structure, disposed on the at least one flexible structure and electrically connected to the conductive pattern of the at least one flexible structure, the circuit structure comprising;

    a second dielectric layer, disposed on the at least one flexible structure and being in contact with the surface of the first dielectric layer where the conductive pattern is on; and

    a circuit layer, disposed on and extending into the second dielectric layer to be in contact with the conductive pattern of the at least one flexible structure,wherein the at least one flexible structure is interposed in the circuit structure, a portion of the first dielectric layer and a portion of the conductive pattern of the at least one flexible structure are extended out from an edge of the circuit structure.

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