CIRCUIT BOARD, DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

• US 20200137898A1
• Filed: 05/28/2019
• Published: 04/30/2020
• Est. Priority Date: 10/24/2018
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectric Technology Co. Ltd. (BOE Technology Group Co., Ltd.)
• Original Assignee: Hefei Xinsheng Optoelectric Technology Co. Ltd. (BOE Technology Group Co., Ltd.)
• Inventors: XIE, Enming, HAN, Dongxu, BAO, Wenchao, CAO, Chun
• Granted Patent: US 10,939,564 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 1/10 Distribution of clock signals , e.g. skew
• CPC Class Codes: G06F 1/18 Packaging or power distribution
• CPC Class Codes: G09G 2310/0264 Details of driving circuits
• CPC Class Codes: G09G 2310/08 Details of timing specific for flat panels, other than clock recovery
• CPC Class Codes: H05K 1/0295 adapted for choosing between different types or different locations of mounted components
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09127 PCB or component having an integral separable or breakable part
• CPC Class Codes: H05K 2201/10128 Display
• CPC Class Codes: H05K 5/0017 with operator interface units

Abstract

A circuit board includes a substrate, an input binding region and at least two output binding regions disposed on the substrate. Each of the output binding regions includes a plurality of binding portions, and the number of the binding portions included in different output binding regions is different. The substrate is configured to output a signal received by the input binding region to respective binding portions included in each of the output binding regions.

Claims

1. A circuit board, comprising:

a substrate;

an input binding region; and

at least two output binding regions,

wherein the input binding region and the at least two output binding regions are disposed on the substrate,

each of the at least two output binding regions comprises a plurality of binding portions, and a number of binding portions included in different output binding regions is different, and

the substrate is configured to output a signal received by the input binding region to respective binding portions included in each of the at least two output binding regions.

2. The circuit board according to claim 1, wherein the at least two output binding regions comprise a first output binding region and a second output binding region, the first output binding region comprises an odd number of the binding portions, the second output binding region includes an even number of binding portions.

3. The circuit board according to claim 1, wherein a separation region is arranged between two adjacent output binding regions of the at least two output binding regions, and the substrate comprises a hollow structure located at the separation region.

4. The circuit board according to claim 1, wherein the at least two output binding regions are located on a same side of the substrate, and the input binding region is located at a side opposite to the side of the substrate where the at least two output binding regions are located.

5. The circuit board according to claim 1, wherein the plurality of binding portions included in each of the output binding regions is arranged in a first direction.

6. The circuit board according to claim 5, wherein a distance between two adjacent output binding regions of the at least two output binding regions in a direction perpendicular to the first direction is greater than or equal to 5 mm.

7. A display device, comprising:

a display panel, a plurality of driving modules, a timing control module, and the circuit board according to claim 1, wherein the plurality of driving modules are bound to an edge of the display panel, and the plurality of driving modules is also bound to a target output binding region in which a number of binding portions is the same as a number of the driving modules in the circuit board, and the timing control module is bound to the input binding region of the circuit board.

8. The display device according to claim 7, wherein the at least two output binding regions comprise a first output binding region and a second output binding region, the first output binding region comprises an odd number of the binding portions, the second output binding region comprises an even number of binding portions.

9. The display device according to claim 7, wherein a separation region is arranged between two adjacent output binding regions of the at least two output binding regions, and the substrate comprises a hollow structure located at the separation region.

10. The display device according to claim 7, wherein the at least two output binding regions are located on a same side of the substrate, and the input binding region is located at a side opposite to the side of the substrate where the at least two output binding regions are located.

11. The display device according to claim 7, wherein the plurality of binding portions included in each of the output binding regions are arranged in a first direction.

12. The display device according to claim 11, wherein a distance between two adjacent output binding regions of the at least two output binding regions in a direction perpendicular to the first direction is greater than or equal to 5 mm.

13. A method for manufacturing a circuit board according to claim 1, comprising:

forming an input binding region and at least two output binding regions on the substrate;

wherein each of the at least two output binding regions includes a plurality of binding portions, and a number of binding portions included in different output binding regions is different;

the substrate is configured to output a signal received by the input binding region to respective binding portions included in each of the at least two output binding regions.

14. A method for manufacturing a display device according to claim 7, comprising:

binding the timing control module to the input binding region of the circuit board;

determining a number of drive modules to be bound to the circuit board based on a resolution of the display device;

determining a target output binding region in which a number of binding portions in the circuit board is the same as the number of the driving modules;

binding the driving modules to a plurality of binding portions in the target output binding region in a one-to-one manner; and

binding the driving modules to an edge of the display panel.

15. The method according to claim 14, wherein when a side of the target output binding region away from the input binding region comprises a non-target output binding region, before binding the driving modules to the target output binding region of the circuit board, the method further comprising:

removing the non-target output binding region from the circuit board.