HEAT DISSIPATION ASSEMBLY AND MAINBOARD MODULE

• US 20200137925A1
• Filed: 09/23/2019
• Published: 04/30/2020
• Est. Priority Date: 10/24/2018
• Status: Active Grant

• Current Assignee: Gigabyte Technology Company Limited (Giga-Byte Technology Co.)
• Original Assignee: Gigabyte Technology Company Limited (Giga-Byte Technology Co.)
• Inventors: Huang, Shun-Chih, Mao, Tai-Chuan, Lin, Yi-Jhen
• Granted Patent: US 10,973,150 B2
• Time in Patent Office: Days
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28F 1/022 with multiple channels
• CPC Class Codes: F28F 27/02 for controlling the distribution of heat-exchange media between different channels static flow control means in header boxes F28F9/026; arrangements of guide plates or guide vanes F28F9/22, F28F25/12
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20272 Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

Abstract

A heat dissipation assembly includes a case and a partition structure. The case includes a cavity, a first water hole, and a second water hole, wherein the cavity includes a first region and a second region communicated with each other. The first water hole and the second water hole are communicated with the first region. The partition structure includes a separation wall and a separation layer connected to each other, wherein the separation wall is vertically disposed in the first region to separate a first flow path and a second flow path disposed in left and right portions in the first region. The separation layer is horizontally disposed in the second region to separate a third flow path and a fourth flow path disposed in upper and lower portions in the second region.

Claims

1. A heat dissipation assembly, comprising:

a case comprising a cavity, a first water hole, and a second water hole, wherein the cavity comprises a first region and a second region communicated with each other, and the first water hole and the second water hole are communicated with the first region of the cavity; and

a partition structure comprising a separation wall and a separation layer connected to each other, wherein the separation wall is vertically disposed in the first region of the cavity to separate a first flow path and a second flow path disposed in left and right portions in the first region, and the separation layer is horizontally disposed in the second region of the cavity to separate a third flow path and a fourth flow path disposed in upper and lower portions in the second region, wherein the first flow path is communicated with the third flow path, the third flow path is communicated with the fourth flow path, and the fourth flow path is communicated with the second flow path.

2. The heat dissipation assembly of claim 1, wherein the separation wall is disposed in a portion of the first region, the first water hole is adjacent to the first flow path beside the separation wall, and the second water hole is away from the separation wall.

3. The heat dissipation assembly of claim 1, wherein the third flow path is located below the fourth flow path in the second region.

4. The heat dissipation assembly of claim 1, wherein the third flow path is located above the fourth flow path in the second region.

5. The heat dissipation assembly of claim 1, wherein the first region and the second region of the case have a height difference.

6. The heat dissipation assembly of claim 1, wherein the partition structure further comprises two baffles, wherein one of the baffles is located between the first flow path and the fourth flow path to block the first flow path and the fourth flow path, and the other baffle is located between the second flow path and the third flow path to block the second flow path and the third flow path.

7. A mainboard module, comprising:

a mainboard;

a first heat source disposed on the mainboard;

a second heat source disposed on the mainboard; and

a heat dissipation assembly, comprising;

a case comprising a cavity, a first water hole, and a second water hole, wherein the cavity comprises a first region and a second region communicated with each other, the first water hole and the second water hole are communicated with the first region of the cavity, the case is disposed at the first heat source at a portion corresponding to the first region, and the case is disposed at the second heat source at a portion corresponding to the second region; and

a partition structure comprising a separation wall and a separation layer connected to each other, wherein the separation wall is vertically disposed in the first region of the cavity to separate a first flow path and a second flow path disposed in left and right portions in the first region, and the separation layer is horizontally disposed in the second region of the cavity to separate a third flow path and a fourth flow path disposed in upper and lower portions in the second region, wherein the first flow path is communicated with the third flow path, the third flow path is communicated with the fourth flow path, and the fourth flow path is communicated with the second flow path.

8. The mainboard module of claim 7, wherein the separation wall is disposed in a portion of the first region, the first water hole is adjacent to the first flow path and the first heat source beside the separation wall, and the second water hole is away from the separation wall and the first heat source.

9. The mainboard module of claim 7, wherein the third flow path is located below the fourth flow path in the second region.

10. The mainboard module of claim 7, wherein the third flow path is located above the fourth flow path in the second region.

11. The mainboard module of claim 7, wherein the first region and the second region of the case have a height difference.

12. The mainboard module of claim 7, wherein the partition structure further comprises two baffles, wherein one of the baffles is located between the first flow path and the fourth flow path to block the first flow path and the fourth flow path, and the other baffle is located between the second flow path and the third flow path to block the second flow path and the third flow path.