Thermosetting resinous compositions from epoxy resins and polyamides derived from polymeric fat acids

• US 2,705,223 A
• Filed: 03/11/1952
• Issued: 03/29/1955
• Est. Priority Date: 03/11/1952
• Status: Expired due to Term

• Current Assignee: Harold Wittcoff, Malcolm M. Renfrew
• Original Assignee: Harold Wittcoff, Malcolm M. Renfrew
• Inventors: Renfrew, Malcolm M., HAROLD WITTCOFF
• Application Number:
  US03/276,054
• Time in Patent Office: 1,113 Days
• US Class Current: 525/533
• CPC Class Codes: C08L 2666/22 Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 77/08 from polyamines and polymerised unsaturated fatty acids
• CPC Class Codes: C09J 177/08 from polyamines and polymerised unsaturated fatty acids
• CPC Class Codes: Y10S 52/07 Synthetic building materials, reinforcements and equivalents

Claims

1. COMPOSITION OF MATTER COMPRISING AN EPOXY RESINOUS MATERIAL CONTAINING TERMINAL EPOXY GROUPS AND A POLYMERIC POLYAMIDE CURING AGENT, SAID POLYAMIDE BEING THE REACTION PRODUCT OF POLYMERIC FAT ACIDS CONTAINING AT LEAST 2 CARBOXYL GROUPS. AND AN ALIPHATIC POLYAMINE SAID POLYAMIDE CONTAINING FREE GROUPS SELECTED FROM THE GROUP CONSISTING OF AMINE GROUPS AND CARBOXYL GROUPS.