Platinizing tantalum

• US 2,719,797 A
• Filed: 05/23/1950
• Issued: 10/04/1955
• Est. Priority Date: 05/23/1950
• Status: Expired due to Term

• Current Assignee: Edgar F. Rosenblatt, Johann G. Cohn
• Original Assignee: Edgar F. Rosenblatt, Johann G. Cohn
• Inventors: Rosenblatt, Edgar F., Cohn, Johann G.
• Application Number:
  US03/163,782
• Time in Patent Office: 1,960 Days
• US Class Current: 205/170
• CPC Class Codes: C23F 13/02 cathodic; Selection of conditions, parameters or procedures for cathodic protection, e.g. of electrical conditions
• CPC Class Codes: C25D 5/50 by heat-treatment
• CPC Class Codes: H01J 19/00 Details of vacuum tubes of the types covered by group H01J21/00
• CPC Class Codes: H01J 2893/0022 Manufacture
• CPC Class Codes: Y10S 205/917 Treatment of workpiece between coating steps
• CPC Class Codes: Y10S 428/929 Electrical contact feature
• CPC Class Codes: Y10S 428/934 Electrical process
• CPC Class Codes: Y10S 428/936 Chemical deposition, e.g. electroless plating
• CPC Class Codes: Y10S 428/94 Pressure bonding, e.g. explosive
• CPC Class Codes: Y10T 428/12819 Group VB metal-base component
• CPC Class Codes: Y10T 428/12875 Platinum group metal-base component

Claims

1. A METHOD OF PROVIDING AN ADHERENT COATING OF PLATINUM METAL ON A BASE OF MATERIAL OF THE GROUP CONSISTING OF TANTALUM AND COLUBIUM, COMPRISING THE SEQUENTIAL MANUFACTURING STEPS OF DEPOSITING A THIN CONTINUOUS LAYER OF PLATINUM METAL ON SAID BASE AND HEATING SAID LAYER AND SAID BASE IN PROXIMITY THERETO UNDER INERT CONDITIONS AT AN ELEVATED TEMPERATURE BELOW THE MELTING POINT OF SAID PLATINUM METAL AND SAID BASE MATERIAL AND WITHIN THE RANGE OF ABOUT 800* C. TO ABOUT 1400* C. TO INTER-DIFFUSE SAID METALS AT THE BOUNDARY THEROF, WHEREBY SAID PLATINUM METAL LAYER BECOMES BONDED TO SAID MATERIAL ON ITS OUTER SURFACE AND IS SEPARATED FROM THE BASE BY AN INTERLAYER OF AN ALLOY OF THE PLATINUM WITH THE BASE METAL.