Process of bonding a metal film to a thermoplastic sheet and resulting product

• US 2,740,732 A
• Filed: 07/16/1951
• Issued: 04/03/1956
• Est. Priority Date: 07/16/1951
• Status: Expired due to Term

• Current Assignee: David B. Peck, Preston Robinson
• Original Assignee: David B. Peck, Preston Robinson
• Inventors: Peck, David B., Robinson, Preston
• Application Number:
  US03/237,050
• Time in Patent Office: 1,723 Days
• US Class Current: 428/458
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: C23C 14/20 on organic substrates
• CPC Class Codes: C23C 14/58 After-treatment
• CPC Class Codes: C23C 14/5806 Thermal treatment
• CPC Class Codes: C23C 14/584 Non-reactive treatment
• CPC Class Codes: H01B 1/00 Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
• CPC Class Codes: H01B 3/423 Linear aromatic polyesters
• CPC Class Codes: H01G 4/18 of synthetic material, e.g. derivatives of cellulose H01G4/16 takes precedence
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Claims

1. THE PROCESS OF BONDING A METAL FILM TO A SUBSTANTIALLY LINEAR THERMOPLASTIC PLANAR ORIENTED DIELECTRIC POLYESTER SHEET CONFORMING TO THE RECURRENT FORMULA: