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Encapsulated semiconductor assembly

  • US 2,903,629 A
  • Filed: 10/23/1958
  • Issued: 09/08/1959
  • Est. Priority Date: 10/23/1958
  • Status: Expired due to Term
First Claim
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1. IN COMBINATION, A HOUSING FOR HOUSING A SEMICONDUCTOR ELEMENT HAVING ELECTRODES ASSOCIATED THEREWITH AND ENGAGING SAID ELEMENT AT JUNCTION AREAS THEREON, A FIRST COATING OF ELECTRICAL INSULATING MATERIAL POSITIONED ON THE EXTERIOR SURFACE OF SAID ELEMENT HOUSING AND ON THE EXTERIOR SURFACE OF SAID ELECTRODES TO WITHIN A TERMINAL PORTION ON THE ENDS THEREOF, A SECOND COATING OF METALLIC COMPOSITION POSITIONED ON SAID FIRST COATING, SAID COMPOSITION HAVING A MELTING POINT INTERMEDIATE THE MAXIMUM JUNCTION AREA TEMPERATURE FOR SAID ELEMENT AND THE

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