Encapsulated semiconductor assembly

• US 2,903,629 A
• Filed: 10/23/1958
• Issued: 09/08/1959
• Est. Priority Date: 10/23/1958
• Status: Expired due to Term

• Current Assignee: Norman K. Walker
• Original Assignee: Norman K. Walker
• Inventors: Walker, Norman K.
• Application Number:
  US03/769,246
• Time in Patent Office: 320 Days
• US Class Current: 257/714
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49171 with encapsulating

Claims

1. IN COMBINATION, A HOUSING FOR HOUSING A SEMICONDUCTOR ELEMENT HAVING ELECTRODES ASSOCIATED THEREWITH AND ENGAGING SAID ELEMENT AT JUNCTION AREAS THEREON, A FIRST COATING OF ELECTRICAL INSULATING MATERIAL POSITIONED ON THE EXTERIOR SURFACE OF SAID ELEMENT HOUSING AND ON THE EXTERIOR SURFACE OF SAID ELECTRODES TO WITHIN A TERMINAL PORTION ON THE ENDS THEREOF, A SECOND COATING OF METALLIC COMPOSITION POSITIONED ON SAID FIRST COATING, SAID COMPOSITION HAVING A MELTING POINT INTERMEDIATE THE MAXIMUM JUNCTION AREA TEMPERATURE FOR SAID ELEMENT AND THE