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Heat dissipating mounting structure for semiconductor devices

  • US 3,143,592 A
  • Filed: 11/14/1961
  • Issued: 08/04/1964
  • Est. Priority Date: 11/14/1961
  • Status: Expired due to Term
First Claim
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1. A MOUNTING STRUCTURE ADAPTED TO SUPPORT SEMICONDUCTOR DEVICES AND TO DISSIPATE THE HEAT GENERATED BY THE OPERATION THEREOF, COMPRISING AT LEAST TWO SUPPORT PLATES, EACH OF SAID SUPPORT PLATES BEING ADAPTED TO SUPPORT A SEMICONDUCTOR DEVICE;

  • TWO SUBSTANTIALLY-PARALLEL HOLLOW EXTENSIONS THERMALLY COUPLED TO EACH OF SAID SUPPORT PLATES ADJACENT THE DEVICE SUPPORTED THEREON;

    HOLLOW TUBES INDIVIDUALLY ASSOCIATED WITH EACH OF SAID PLATES AND INTERCONNECTING THE OPEN ENDS OF SAID EXTENSIONS ASSOCIATED THEREWITH TO FORM A CLOSED LIQUID-VAPOR SYSTEM, SAID TUBES INCLUDING A PORTION DISPOSED ABOVE SAID SUPPORT PLATES;

    A MATERIAL DISPOSED IN SAID TUBES AND EXTENSIONS AT A PRESSURE SO AS TO BE LIQUID AT ROOM TEMPERATURES AND TO BE A VAPOR AT THE OPERATING TEMPERATURE OF THE SEMICONDUCTOR DEVICE WHEREBY ANY VAPOR OF SAID MATERIAL TENDS TO COLLECT IN SAID TUBE PORTIONS AND IS CONDENSED BY HEAT EXCHANGE WITH THE ATMOSPHERE;

    AN INDIVIDUAL SIDE MEMBER SECURED TO EACH OF SAID HOLLOW EXTENSIONS ASSOCIATED WITH EACH OF SAID SUPPORT PLATES, MEANS ON SAID SIDE MEMBERS FOR INTERLOCKING THE SIDE MEMBERS OF ADJACENT ONES OF SAID PLATES, AND A PROTUBERANCE PROJECTING FROM EACH OF SAID EXTENSIONS TO ENGAGE THE EXTENSIONS ASSOCIATED WITH THE ADJACENT PLATE.

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