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Method of making printed circuits

  • US 3,146,125 A
  • Filed: 05/31/1960
  • Issued: 08/25/1964
  • Est. Priority Date: 05/31/1960
  • Status: Expired due to Term
First Claim
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1. A PROCESS FOR FORMING PRINTED CIRCUITS WHICH CONSISTS ESSENTIALLY OF PROVIDING AN INSULATING BASE WITH AT LEAST ONE SURFACE HAVING ADHERED THERETO BY MEANS OF AN ADHESIVE CURABLE RESINOUS BONDING AGENT FINELY DIVIDED, DISCRETE PARTICLES OF CUPROUS OXIDE AT NUMEROUS INDIVIDUAL SITES, THE PARTICLES OF CUPROUS OXIDE BEING PRESENT IN AN AMOUNT OF BETWEEN ABOUT 0.25 AND 80 PERCENT OF THE COMBINED WEIGHT OF THE ADHESIVE RESINOUS BONDING AGENT AND CUPROUS OXIDE, AND BEING IN THE FORM OF CU2O, CURING THE ADHESIVE RESINOUS BONDING AGENT TO FIRMLY ADHERE THE FINELY DIVIDED PARTICLES OF CUPROUS OXIDE TO THE SURFACE WHILE RETAINING THE DISCRETENSES OF THE PARTICLES AND THEIR PRESENCE AT NUMEROUS INDIVIDUAL SITES, REDUCING AT LEAST A PORTION OF THE CUPROUS OXIDE PARTICLES ADHESIVELY BONDED TO THE SURFACE TO METALLIC COPPER PARTICLES, AND SUBJECTING THE RESULTING INSULATING BASE TO AN ELECTROLESS METAL DEPOSITION BATH TO ELECTROLESSLY DEPOSIT METAL DIRECTLY ON SAID METALLIC COPPER PARTICLES.

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