Method of making printed circuits

• US 3,146,125 A
• Filed: 05/31/1960
• Issued: 08/25/1964
• Est. Priority Date: 05/31/1960
• Status: Expired due to Term

• Current Assignee: Frederick W. Schneble Jr, John F. Mccormack, Joseph Polichette, Rudolph J. Zeblisky
• Original Assignee: Frederick W. Schneble Jr, John F. Mccormack, Joseph Polichette, Rudolph J. Zeblisky
• Inventors: Schneble, Frederick W. Jr., Mccormack, John F., Zeblisky, Rudolph J., JOSEPH POLICHETTE
• Application Number:
  US04/033,361
• Time in Patent Office: 1,547 Days
• US Class Current: 156/62.2
• CPC Class Codes: C23C 18/1608 from pretreatment step, i.e. selective pre-treatment
• CPC Class Codes: C23C 18/1641 Organic substrates, e.g. resin, plastic
• CPC Class Codes: C23C 18/1653 Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
• CPC Class Codes: C23C 18/208 with use of metal first
• CPC Class Codes: C23C 18/2086 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: H01B 3/004 with conductive additives or conductive layers
• CPC Class Codes: H02K 3/26 consisting of printed conductors
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0236 Plating catalyst as filler in insulating material
• CPC Class Codes: H05K 2203/1157 Using means for chemical reduction
• CPC Class Codes: H05K 2203/125 Inorganic compounds, e.g. silver salt
• CPC Class Codes: H05K 3/105 by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: H05K 3/182 characterised by the patterning method
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Claims

1. A PROCESS FOR FORMING PRINTED CIRCUITS WHICH CONSISTS ESSENTIALLY OF PROVIDING AN INSULATING BASE WITH AT LEAST ONE SURFACE HAVING ADHERED THERETO BY MEANS OF AN ADHESIVE CURABLE RESINOUS BONDING AGENT FINELY DIVIDED, DISCRETE PARTICLES OF CUPROUS OXIDE AT NUMEROUS INDIVIDUAL SITES, THE PARTICLES OF CUPROUS OXIDE BEING PRESENT IN AN AMOUNT OF BETWEEN ABOUT 0.25 AND 80 PERCENT OF THE COMBINED WEIGHT OF THE ADHESIVE RESINOUS BONDING AGENT AND CUPROUS OXIDE, AND BEING IN THE FORM OF CU2O, CURING THE ADHESIVE RESINOUS BONDING AGENT TO FIRMLY ADHERE THE FINELY DIVIDED PARTICLES OF CUPROUS OXIDE TO THE SURFACE WHILE RETAINING THE DISCRETENSES OF THE PARTICLES AND THEIR PRESENCE AT NUMEROUS INDIVIDUAL SITES, REDUCING AT LEAST A PORTION OF THE CUPROUS OXIDE PARTICLES ADHESIVELY BONDED TO THE SURFACE TO METALLIC COPPER PARTICLES, AND SUBJECTING THE RESULTING INSULATING BASE TO AN ELECTROLESS METAL DEPOSITION BATH TO ELECTROLESSLY DEPOSIT METAL DIRECTLY ON SAID METALLIC COPPER PARTICLES.