Method of manufacturing a hermetically sealed semiconductor capsule

• US 3,203,083 A
• Filed: 02/08/1961
• Issued: 08/31/1965
• Est. Priority Date: 02/08/1961
• Status: Expired due to Term

• Current Assignee: Robert E. Obenhaus
• Original Assignee: Robert E. Obenhaus
• Inventors: Obenhaus, Robert E.
• Application Number:
  US04/087,863
• Time in Patent Office: 1,665 Days
• US Class Current: 228/115
• CPC Class Codes: B23K 20/16 with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
• CPC Class Codes: H01L 23/041 the container being a hollow construction having no base used as a mounting for the semiconductor body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Claims

1. THE METHOD OF MANUFACTURING A HERMETICALLY SEALED SEMICONDUCTOR CAPSULE OR THE LIKE, COMPRISING FORMING SPACE-ENCLOSING PARTS WITH AN OUTWARDLY DIRECTED CIRCUMFERENTIAL COMPARATIVELY HARD METAL FLANGE ON EACH, EACH OF SAID HARD METAL FLANGES BEING FORMED WITH A COMPARATIVELY SOFT FACE-FORMING METAL METALLURGICALLY PREBONDED THEREON, ONE OF SAID FLANGES HAVING FORMED IN ITS SOFT METAL FACE A CIRCUMFERENTIAL PROTRUSION AND THE OTHER FLANGE BEING FORMED IN ITS SOFT METAL FACE WITH A NONGROOVED PORTION FOR ENGAGEMENT BY SAID PROTRUSION, BRINGING SAID HARD FLANGES TOGETHER WITH SAID PREBONDED SOFT METAL THEREBETWEEN, AND CIRCUMFERENTIALLY APPLYING OPPOSING FORCES ON THE HARD METAL FLANGES TO FORCE THEM TOGETHER TO DEFORM THE PROTRUSION TO EFFECT A SOLID-PHASE BOND AT LEAST IN THE REGION OF THE PROTRUSION.

4. THE METHOD OF MANUFACTURING A HERMETICLLY SEALED SEMICONDUCTOR CAPSULE OR THE LIKE, COMPRISING FORMING SPACE-ENCLOSING PARTS WITH AN OUTWARDLY DIRECTED CIRCUMFERENTIAL COMPARATIVELY HARD METAL FLANGE ON EACH, ONE OF SAID FLANGES HAVING A CIRCUMFERENTIAL PROTRUSION EXTENDING FROM ITS INNER FACE, THE OTHER FLANGE BEING FORMED WITH AN INNER NONGROOVED PORTION OPPOSITE SAID PROTRUSION, AT LEAST ONE OF SAID FLANGES BENG FORMED WITH AN INNER METALLURGICALLY PREBONDED COMPARATIVELY SOFT METAL FACING IN A POSITION TO BE SQUEEZED BY THE PROTRUSION WHEN THE FLANGES ARE PUSHED TOGETHER, AND CIRCUMFERENTIALLY APPLYING OPPOSING FORCES ON THE HARD METAL FLANGES TO FORCE THEM TOGETHER TO SQUEEZE SAID SOFT METAL FACING BE TWEEN THE PROTRUSION ON THE ONE FLANGE AND THE NONGROOVED PORTION ON THE OTHER FLANGE TO SOLID-PHASE BOND THE SOFT METAL TO EFFECT A STRONG HERMETICALLY SEALED CONNECTION BETWEEN THE FLANGES AT LEAST IN THE REGION OF THE PROTRUSION.