Heat sink and method of operating the same

• US 3,215,194 A
• Filed: 08/13/1963
• Issued: 11/02/1965
• Est. Priority Date: 08/13/1963
• Status: Expired due to Term

• Current Assignee: John H. Sununu, Leonhard Katz
• Original Assignee: John H. Sununu, Leonhard Katz
• Inventors: Sununu, John H., LEONHARD KATZ
• Application Number:
  US04/301,745
• Time in Patent Office: 812 Days
• US Class Current: 165/80.3
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 165/902 Heat storage

Claims

1. A HEAT DISSIPATING STRUCTURE FOR USE IN CONNECTION WITH A HEAT-GENERATING SEMI-CONDUCTOR DEVICE AND THE LIKE HAVING A PREDETERMINED MAXIMUM SAFE OPERATING TEMPERATURE, SAID STRUCTURE COMPRISING, IN COMBINATION, A HEAT-CONDUCTIVE PLATE ADAPTED FOR MOUNTING THE DEVICE AT A FIRST REGION THEREOF, SAID PLATE HAVING A PLURALITY OF SPACED FIN RADIATORS TRANSVERSE TO SAID PLATE AT OTHER REGIONS THEREOF REMOTE FROM SAID FIRST REGION, HEAT FROM THE SAID DEVICE BEING CONDUCTED ALONG THE PLATE TO THE FIN RADIATORS, THE SAID FIN RADIATORS BEING EXPOSED TO THE SURROUNDING ATMOSPHERE WHEREBY SAIDHEAT IS DISSIPATED BY SAID FIN RADIATORS TO SAID ATMOSPHERE, CONTAINER MEANS, A HIGH HEAT-OF-FUSION MATERIAL DISPOSED WITHIN THE CON-