Thermal coupling of parallel connected semiconductor elements

• US 3,231,794 A
• Filed: 06/05/1961
• Issued: 01/25/1966
• Est. Priority Date: 06/05/1961
• Status: Expired due to Term

• Current Assignee: Edward J. Diebold
• Original Assignee: Edward J. Diebold
• Inventors: Diebold, Edward J.
• Application Number:
  US04/125,311
• Time in Patent Office: 1,695 Days
• US Class Current: 257/694
• CPC Class Codes: H01L 25/03 all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• CPC Class Codes: H01L 29/00 Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor H01L31/00 - H01L33/00, H10K10/00, H10N take precedence; details other than of semiconductor bodies or of electrodes thereof H01L23/00; devices consisting of a plurality of solid state components formed in or on a common substrate H01L27/00
• CPC Class Codes: H01L 29/456 on silicon
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Claims

1. A SEMICONDUCTOR DEVICE;

SAIS SEMICONDUCTOR DEVICE COMPRISING A PLURALITY OF INDIVIDUAL WAFERS OF SILICON MATERIAL HAVING RESPECTIVE JUNCTIONS THEREIN, A COMMON CONDUCTIVE BASE OF MECHANICALLY AND ELECTRICALLY RECEIVING ONE SIDE OF EACH OF SAID WAFERS, AND A COMMON CONDUCTIVE COLLECTOR MEMBER;

ONE SIDE OF EACH SAID PLURALITY OF INDIVIDUAL WAFERS BEING MOUNTED ON SAID SAID COMMON CONDUCTIVE BASE IN SPACE RELATION WITH RESPECT TO ONE ANOTHER;

THE OTHER SIDE OF EACH OF SAID PLURALITY OF WAFERS BEING ELECTRICALLY CONNECTED TO SAID COMMON CONDUCTIVE COLLECTOR MEMBER;

SAID WAFERS BEING THERMALLY COUPLED TO ONE ANOTHER TO MAINTAIN A RESPECTIVE FIXED TEMPERATURE;

EACH OF SAID WAFERS HAVING A SURFACE CONFIGURATION WHICH FITS WITHIN A CIRCLE HAVING A DIAMETER OF APPROXIMATELY 3/16 OF AN INCH;

SAID WAFERS BEING SPACED FROM ONE ANOTHER BY A DISTANCE OF APPROXIMATELY THE DIAMETER OF SAID CIRCLE;

SAID COMMON CONDUCTIVE BASE HAVING A THICKNESS OF APPROXIMATELY THE DIAMETER OF SAID CIRCLE.