Cap for hermetically sealed semiconductor

• US 3,265,802 A
• Filed: 11/18/1963
• Issued: 08/09/1966
• Est. Priority Date: 11/18/1963
• Status: Expired due to Term

• Current Assignee: Allan Davis, Gary Hillman
• Original Assignee: Allan Davis, Gary Hillman
• Inventors: Hillman, Gary, ALLAN DAVIS
• Application Number:
  US04/324,516
• Time in Patent Office: 995 Days
• US Class Current: 174/16.3
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Claims

2. A HEADER FOR AN ENVELOPE ADAPTED TO ENCLOSE A SEMICONDUCTOR, SAID HEADER COMPRISING:

(A) AN ELECTRICALLY INSULATING HEAT CONDUCTING FIRST ELEMENT HAVING A FIRST FACE AND A SECOND FACE OPPOSITE SAID FIRST FACE, (B) SAID FIRST FACE OF SAID FIRST ELEMENT ADAPTED TO BE PLACED IN HEAT CONDUCTING RELATION TO SAID SEMICONDUCTOR, (C) A HEAT CONDUCTING SECOND ELEMENT ADJACENT AND SUBSTANTIALLY COEXTENSIVE WITH THE SECOND FACE OF SAID FIRST ELEMENT AND IN HEAT CONDUCTING RELATION THEREWITH, (D) AT LEAST ONE LEAD EXTENDING FROM A POINT OUTSIDE SAID ENVELOPE TO A POINT WITHIN THE PERIMETER OF THE SECOND FACE OF SAID FIRST ELEMENT, SAID LEAD BEING SUBSTANTIALLY PARALLEL TO THE SECOND FACE OF SAID FIRST ELEMENT, SAID LEAD FURTHER EXTENDING THROUGH SAID FIRST ELEMENT FROM THE SECOND FACE THEREOF TO THE FIRST FACE THEREOF AND ADAPTED TO BE SECURED IN ELECTRICAL CONTACT WITH A PORTION OF SAID SEMICONDUCTOR, (E) AT LEAST ONE SLOT IN SAID SECOND ELEMENT EXTENDING INWARDLY FROM THE PERIMETER THEREOF, SAID SLOT PROVIDING A RECESS FOR ONE LEAD, (F) THE DEPTH OF SAID SLOT BEING GREATER THAN THE THICKNESS OF SAID LEAD.