Automated semiconductor device method and structure

• US 3,281,628 A
• Filed: 08/16/1965
• Issued: 10/25/1966
• Est. Priority Date: 08/14/1964
• Status: Expired due to Term

• Current Assignee: Alfred Bauer, Dieter Baumann, Herbert Scholz, Wilhelm Engbert
• Original Assignee: Alfred Bauer, Dieter Baumann, Herbert Scholz, Wilhelm Engbert
• Inventors: Bauer, Alfred, Scholz, Herbert, WILHELM ENGBERT, DIETER BAUMANN
• Application Number:
  US04/486,585
• Time in Patent Office: 435 Days
• US Class Current: 257/666
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/49517 Additional leads
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Claims

13. A DEVICE FOR USE IN MANUFACTUREING SEMICONDUCTOR UNITS, COMPRISING:

(A) A SHEET OF CONDUCTIVE MATERIAL HAVING AT LEAST ONE GROUP OF PARALLEL, LATERALLY EXTENDING STRIPS WHICH ARE LONGITUDINALLY DISPLACED FROM ONE ANOTHER, AND AT LEAST ONE LONGITUDINAL SIDE PIECE TO WHICH ONE END OF EACH OF SAID STRIPS IS ATTACHED;

(B) AT LEAST ONE SEMICONDUCTOR UNIT CONSTITUTED BY A SEMICONDUCTOR BODY ON ONE SURFACE OF WHICH IS DISPOSED AT LEAST ONE ELECTRODE;

AND (C) CONNECTING MEANS CONNECTING EACH SAID SEMICONDUCTOR BODY TO ONE OF THE STRIPS OF EACH SAID GROUP IN A BARRIER LAYER-FREE MANNER AND CONDUCTIVELY CONNECTING EACH SAID ELECTRODE TO A CORRESPONDING ONE OF THE REMAINING STRIPS OF SAID GROUP.