Jogging device in apparatus for treating semiconductor wafers in gas

• US 3,295,492 A
• Filed: 05/25/1964
• Issued: 01/03/1967
• Est. Priority Date: 06/01/1963
• Status: Expired due to Term

• Current Assignee: Norbert Schink
• Original Assignee: Norbert Schink
• Inventors: Schink, Norbert
• Application Number:
  US04/369,857
• Time in Patent Office: 953 Days
• US Class Current: 118/722
• CPC Class Codes: C23C 16/4583 the substrate being supported substantially horizontally
• CPC Class Codes: C30B 25/12 Substrate holders or susceptors
• CPC Class Codes: C30B 31/103 Mechanisms for moving either the charge or heater
• CPC Class Codes: C30B 31/14 Substrate holders or susceptors
• CPC Class Codes: H01L 21/00 Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• CPC Class Codes: Y10S 414/135 Associated with semiconductor wafer handling

Claims

1. IN AN APPARATUS FOR HEAT TREATING SEMICONDUCTOR WAFERS IN GAS, THE COMBINATION COMPRISING FURNACE MEANS, HOLDER MEANS FOR VERTICALLY SUPPORTING A STACK OF SEMICONDUCTOR WAFERS SUPERIMPOSED ON ONE ANOTHER WITHIN SAID FURNACE MEANS FOR HEAT TREATING THE WAFERS THEREIN, AND OSCILLATING MEANS FOR IMPARTING A SERIES OF SHOCKS TO THE SEMICONDUCTOR WAFERS OF SAID STACK HAVING AT LEAST A COMPONENT IN THE AXIAL DIRECTION THEREOF AS THE WAFERS ARE BEING HEAT TREATED WHEREBY EACH OF SAID HEATED SEMICONDUCTOR WAFERS IS DISPLACED AND AT LEAST PARTLY SPACED TEMPORARILY FROM THE ADJACENT SEMICONDUCTOR WAFER OF THE STACK.