Electroless copper plating on ceramic material
First Claim
1. IN A METHOD OF CHEMICALLY DEPOSITING COPPER ON A SURFACE OF AN ALUMINA SUBSTRATE COMPRISING THE STEPS OF CLEANING SAID SUBSTRATE, SENSITIZING IT, RINSING IT WITH WATER AND IMMERSING IT IN A PLATING BATH, THE IMPROVEMENT COMPRISING THE STEPS OF MAKING THE SURFACE OF SAID ALUMINA SUBSTRATE SUBMICROSCOPICALLY POROUS BY LEACHING AFTER SAID CLEANING STEP IN A BATH COMPRISING ABOUT 85% AQUEOUS SOLUTION OF ORTHO-PHOSPHORIC ACID, SENSITIZING THE LEACHED SURFACE BY SUCCESSIVELY IMMERSING SAID SUBSTRATE IN AN AQUEOUS SOLUTION OF STANNOUS CHLORIDE AND AN AQUEOUS SOLUTIO OF PALLADIUM CHLORIDE FOR ABOUT 3 MINUTES EACH, AND THEN IMMERSING SAID SUBSTRATE IN A PLATING BATH CONTAINING A SALT OF COPPER TO WHICH BATH TETRASODIUM SALT OF ETHYLENEDIAMINETETRAACETIC ACID HAS BEEN ADDED IN THE AMOUNT OF AT LEAST 0.5% BY VOLUME.
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1 Claim
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1. IN A METHOD OF CHEMICALLY DEPOSITING COPPER ON A SURFACE OF AN ALUMINA SUBSTRATE COMPRISING THE STEPS OF CLEANING SAID SUBSTRATE, SENSITIZING IT, RINSING IT WITH WATER AND IMMERSING IT IN A PLATING BATH, THE IMPROVEMENT COMPRISING THE STEPS OF MAKING THE SURFACE OF SAID ALUMINA SUBSTRATE SUBMICROSCOPICALLY POROUS BY LEACHING AFTER SAID CLEANING STEP IN A BATH COMPRISING ABOUT 85% AQUEOUS SOLUTION OF ORTHO-PHOSPHORIC ACID, SENSITIZING THE LEACHED SURFACE BY SUCCESSIVELY IMMERSING SAID SUBSTRATE IN AN AQUEOUS SOLUTION OF STANNOUS CHLORIDE AND AN AQUEOUS SOLUTIO OF PALLADIUM CHLORIDE FOR ABOUT 3 MINUTES EACH, AND THEN IMMERSING SAID SUBSTRATE IN A PLATING BATH CONTAINING A SALT OF COPPER TO WHICH BATH TETRASODIUM SALT OF ETHYLENEDIAMINETETRAACETIC ACID HAS BEEN ADDED IN THE AMOUNT OF AT LEAST 0.5% BY VOLUME.
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