Integrated circuit using oxide insulated terminal pads on a sic substrate

• US 3,308,354 A
• Filed: 06/28/1965
• Issued: 03/07/1967
• Est. Priority Date: 06/28/1965
• Status: Expired due to Term

• Current Assignee: Thomas N. Tucker
• Original Assignee: Thomas N. Tucker
• Inventors: Tucker, Thomas N.
• Application Number:
  US04/467,359
• Time in Patent Office: 617 Days
• US Class Current: 257/524
• CPC Class Codes: H01L 21/00 Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• CPC Class Codes: H01L 21/76297 Dielectric isolation using EPIC techniques, i.e. epitaxial passivated integrated circuit
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05556 in side view
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/485 consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts H01L23/4821, H01L23/4822, H01L23/4824, H01L23/4825 take precedence; materials H01L23/532, bond pads H01L24/02, bump connectors H01L24/10
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/12036 PN diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: Y10S 148/085 Isolated-integrated
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base

Claims

1. A SEMICONDUCTOR ELECTRONIC INTEGRATED CIRCUIT COMPRISING:

A BASE OF ELECTRICALLY INSULATIVE MATERIAL HAVING HIGH THERMAL CONDUCTIVITY, AT LEAST ONE ACTIVE SEMICONDUCTOR ELECTRONIC ELEMENT IMBEDDED IN SAID BASE, A PLURALITY OF TERMINAL PADS ON SAID BASE, SAID TERMINAL PADS BEING SPACED FROM SAID ACTIVE SEMICONDUCTOR ELEMENTS AND HAVING AFFIXED THERETO ELECTRICAL INTERCONNECTIONS WITH SAID ACTIVE ELEMENTS, AND A BARRIER LAYER OF MATERIAL HAVING LOW THERMAL CONDUCTIVITY INTERPOSED BETWEEN SAID TERMINAL PADS AND SAID BASE TO THERMALLY ISOLATE SAID TERMINAL PADS FROM SAID BASE.