Bonding apparatus

• US 3,309,494 A
• Filed: 06/12/1963
• Issued: 03/14/1967
• Est. Priority Date: 06/12/1963
• Status: Expired due to Term

• Current Assignee: Roy J. Hebert, Sam J. Griffin
• Original Assignee: Roy J. Hebert, Sam J. Griffin
• Inventors: Hebert, Roy J., Griffin, Sam J.
• Application Number:
  US04/287,333
• Time in Patent Office: 1,371 Days
• US Class Current: 219/85.14
• CPC Class Codes: B23K 11/25 Monitoring devices
• CPC Class Codes: B23K 3/03 electrically heated
• CPC Class Codes: B23K 3/0307 with current flow through the workpiece
• CPC Class Codes: G05D 23/1919 characterised by the type of controller
• CPC Class Codes: G05D 23/22 the sensing element being a thermocouple

Claims

1. A RESISTANCE SOLDERING APPARATUS FOR SOLDERING A WORKPIECE, SAID APPARATUS COMPRISING:

A SHEATHED-THERMOCOUPLE FIRST ELECTRODE COMPRISING A HOLLOW SHEATH OF A NON-SOLDERABLE MATERIAL COMPRISING ONE OF STAINLESS STEEL OR INCONEL, SAID SHEATH BEING CLOSED AT ONE END, A THERMOCOUPLE HOUSED WITHIN SAID SHEATH, SAID THERMOCOUPLE BEING CONNECTED TO SAID CLOSED END, SAID THERMOCOUPLE OTHERWISE BEING ELECTRICALLY INSULATINGLY SEPARATED FROM SAID SHEATH, A SECOND ELECTRODE, SAID FIRST AND SECOND ELECTRODES BEING JUXTAPOSED AND TERMINATING ON THE SAME SIDE OF THE WORKPIECE;

AND CONTROL MEANS FOR CONTROLLING THE HEATING CURRENT APPLIED ACROSS SAID ELECTRODES IN A MANNER DEPENDENT ON THE TEMPERATURE OF SAID WORKPIECE AS SENSED BY SAID THERMOCOUPLE, SAID CONTROL MEANS COMPRISING MEANS TO REGULATE SAID HEATING CURRENT TO ACHIEVE CONTROLLED COOLING OF SAID WORKPIECE.