Universal diode matrix package with improved fuse means

• US 3,335,328 A
• Filed: 10/21/1965
• Issued: 08/08/1967
• Est. Priority Date: 10/21/1965
• Status: Expired due to Term

• Current Assignee: Burroughs Corp (Unisys Corporation)
• Original Assignee: Clyde R. Brackett
• Inventors: Brackett, Clyde R.
• Application Number:
  US04/500,405
• Time in Patent Office: 656 Days
• US Class Current: 361/806
• CPC Class Codes: H01L 23/315 the encapsulation having a cavity
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Claims

1. A UNIVERSAL PACKAGE FOR FORMING A MATRIX OF ELECTRONIC COMPONENTS COMPRISING AN INSULATING SUBSTRATE HAVING A TOP SURFACE, A FIRST COMMON CONDUCTOR FORMED ON SAID TOP SURFACE, A PLURALITY OF PAIRS OF CONDUCTORS FORMED ON SAID TOP SURFACE IN OPERATIVE RELATION WITH SAID COMMON CONDUCTOR, EACH PAIR INCLUDING FIRST AND SECOND SPACEDAPART CONDUCTORS, A SEPARATE ELECTRONIC COMPONENT SECURED BETWEEN EACH OF SAID FIRST CONDUCTORS AND SAID COMMON CONDUCTORS, AND A FUSE WIRE SECURED BETWEEN THE FIRST AND SECOND CONDUCTORS OF EACH PAIR, SAID FUSE WIRE STANDING FREE OF ALL ADJACENT COMPONENTS.