Modular circuit package

• US 3,359,461 A
• Filed: 02/15/1967
• Issued: 12/19/1967
• Est. Priority Date: 02/15/1967
• Status: Expired due to Term

• Current Assignee: Chester L. Schuler, Edward Chapman Norman
• Original Assignee: Chester L. Schuler, Edward Chapman Norman
• Inventors: Schuler, Chester L., EDWARD CHAPMAN NORMAN
• Application Number:
  US04/616,244
• Time in Patent Office: 307 Days
• US Class Current: 361/714
• CPC Class Codes: H05K 5/00 Casings, cabinets or drawers for electric apparatus
• CPC Class Codes: H05K 5/0091 Housing specially adapted for small components for resistors H01C; for capacitors H01G; for integrated circuits H01L23/00
• CPC Class Codes: H05K 5/04 Metal casings
• CPC Class Codes: H05K 7/20 Modifications to facilitate cooling, ventilating, or heating
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Claims

1. AN INTEGRATED ELECTRONIC MODULAR POWER CIRCUIT PACKAGE COMPRISING:

A PLURALITY OF INDIVIDUAL ELECTRICALLY CONDUCTIVE, HEAT DISSIPATIVE SIDE WALL ELEMENTS;

THERMALLY CONDUCTIVE, ELECTRICALLY INSULATING MEANS FOR MECHANICALLY AND THERMALLY JOINING ADJACENT ONES OF SAID SIDE WALL ELEMENTS TO FORM A RIGID UNITIZED HOLLOW HOUSING OF SUBSTANTIALLY POLYGINAL CROSS-SECTION HAVING INSULATIVELY SEPARATED AND ELECTRICALLY CONDUCTING SIDE WALLS;

AND ELECTRONIC COMPONENTS CONSTITUTING A MODULAR CIRCUIT DISPOSED WITHIN SAID HOUSING, AT LEAST SOME OF SAID COMPONENTS BEING ATTACHED IN THERMAL CONTACT WITH SAID SIDE WALL ELEMENTS, THE THERMAL CONTACT PORTION OF SOME OF SAID COMPONENTS ALSO MAKING A DIRECT ELECTRICAL CONTACT WITH SELECTED ONES OF SAID SIDE WALL ELEMENTS;

WHEREBY SAID SIDE WALL ELEMENTS PROVIDE PHYSICAL SUPPORT, ELECTRICAL INTERCONNECTION AND THERMAL DISSPATION FOR SAID ELECTRONIC COMPONENTS, TOGETHER WITH STRUCTURAL RIGIDITY FOR SAID MODULAR PACKAGE.