Method and apparatus for controlled deposition of a thin conductive layer

• US 3,374,112 A
• Filed: 03/05/1964
• Issued: 03/19/1968
• Est. Priority Date: 03/05/1964
• Status: Expired due to Term

• Current Assignee: David Danon
• Original Assignee: David Danon
• Inventors: DAVID DANON
• Application Number:
  US04/349,552
• Time in Patent Office: 1,475 Days
• US Class Current: 427/10
• CPC Class Codes: C23C 14/545 using measurement on deposited material
• CPC Class Codes: G01N 1/2853 Shadowing samples
• CPC Class Codes: H01B 1/00 Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors

Claims

1. A METHOD OF FORMING A THIN CONDUCTIVE COATING OF PREDETERMINED THICKNESS, COMPRISING THE STEPS OF:

FORMING GAP SEPARATED CONDUCTIVE REGIONS UPON AN INSULATED BASE STRUCTURE;

ELECTRICALLY CONNECTING SAID GAP SEPARATED CONDUCTIVE REGIONS TO AN IMPEDANCE MEASURING INSTRUMENT;

PLACING A MEMBER TO BE COATED UPON A CONDUCTIVE REGION ON SAID INSULATED BASE, ADJACENT SAID GAP REGION;

GRADUALLY APPLYING A CONDUCTIVE COATING BY VAPOUR DEPOSITION UPON SAID MEMBER TO BE COATED, AND ACROSS SAIS GAP TO ESTABLISH ON ELECTRICAL PATH THEREACROSS;

MEASURING THE IMPEDANCE VARIATION EFFECTED BY THE ESTABLISHING OF SAID CONDUCTIVE PATH ACROSS SAID GAP;

TERMINATING THE APPLICATION OF SAID CONDUCTIVE COATING CORRESPONDING TO SAID IMPEDANCE VARIATION BEING OF A PREDETERMINED MAGITUDE;

REMOVING SAID COATED MEMBER FROM SAID BASE STRUCTURE