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Process for forming holes and multilayer interconnections through a dielectric
US 3,379,568 A
Filed
: 12/21/1964
Issued
: 04/23/1968
Est. Priority Date
: 12/21/1964
Status: Expired due to Term
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Current Assignee
Robert E. Holmes
Original Assignee
Robert E. Holmes
Inventors
Holmes, Robert E.
Application Number
US04/423,626
Time in Patent Office
1,219 Days
Field of Search
US Class Current
427/96.8
CPC Class Codes
C23C 14/042
using masks
H05K 2203/0582
Coating by resist, i.e. res...
H05K 2203/083
Evaporation or sublimation ...
H05K 3/0017
Etching of the substrate by...
H05K 3/288
Removal of non-metallic coa...
H10N 97/00
Electric solid-state thin-f...
Y10S 428/901
Printed circuit
Y10T 428/24339
Keyed
Y10T 428/24802
Discontinuous or differenti...
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