High frequency power transistor having electrodes forming transmission lines

• US 3,387,190 A
• Filed: 08/19/1965
• Issued: 06/04/1968
• Est. Priority Date: 08/19/1965
• Status: Expired due to Term

• Current Assignee: ITT Corporation (ITT, Inc.)
• Original Assignee: Richard H. Winkler
• Inventors: Winkler, Richard H.
• Application Number:
  US04/480,870
• Time in Patent Office: 1,020 Days
• US Class Current: 257/664
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers amplifiers per se H03F
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/4823 connecting the wire to a pin of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

1,125,417. Semi-conductor devices. ITT INDUSTRIES, Inc. 5 Aug., 1966 [19 Aug., 1965], No. 35124/66. Heading H1K. The leads of a transistor are arranged to form input and output transmission lines, the lead connected to either the base region or the emitter region forming a common conductor in both transmission lines. As shown, Fig. 2, a sub-assembly comprises a ceramic plate 11 provided with metallized lands 16, 17, 18 which may be produced by completely metallizing the surface and then forming grooves 21. A metal preform 23 is soldered to the lands 18 and a transistor die 26 is mounted with its collector region in contact with collector land 17. Lands 16 and 17 extend down opposite ends of the ceramic plate and on to the other major face. A plurality of wires (27) are connected between the emitter region of the transistor and the bridge 28 of the preform and a plurality of fine wires (29) are connected between the base region of the transistor and the adjacent end of land 16, Figs. 3 and 4 (not shown). The sub-assembly may now be tested and then mounted by soldering preform 23 to the grooved face of a metal support 12 which forms the emitter connection. Support 12 is provided with a threaded stud 13 by means of which the assembly may be mounted on a header, Figs. 5 and 6 (not shown), or in a stripline, Fig. 7 (not shown). A pair of transistors may be mounted in a coaxial line, Figs. 8 and 9 (not shown). In modifications, (a) the preform is provided with two bridges (73, 74) with upstanding ears (71, 72) to which the support body is connected, the emitter region being connected by fine wires to both of the bridges, Figs. 10 to 13 (not shown), (b) the preform is omitted and the metal support body is suitably shaped to provide a face 97 to which the emitter wires are connected, Fig. 14 (not shown), (c) a resistive layer is inserted between the emitter wires and the bridge of the preform, Fig. 15 (not shown), and (d) the bridge of the preform has a downwardly extending spring lug which directly contacts the emitter region of the transistor, Fig. 16 (not shown), The arrangement of the assembly is such that the emitter wires form a screen between the input and output circuits to reduce interaction. The transistor may also be arranged so that it operates in the common-base configuration.

Claims