Reinforced polyamides and process of preparation thereof

• US 3,419,517 A
• Filed: 06/24/1966
• Issued: 12/31/1968
• Est. Priority Date: 05/31/1963
• Status: Expired due to Term

• Current Assignee: Ross M. Hedrick, William R. Richard Jr
• Original Assignee: Ross M. Hedrick, William R. Richard Jr
• Inventors: Hedrick, Ross M., Richard, William R. Jr.
• Application Number:
  US04/560,247
• Time in Patent Office: 921 Days
• US Class Current: 523/213
• CPC Class Codes: C07F 7/0834 Compounds having one or more O-Si linkage for compounds with C-O-Si linkages see C07F7/18
• CPC Class Codes: C07F 7/1804 Compounds having Si-O-C linkages Si-O-acyl linkages C07F7/1896
• CPC Class Codes: C08G 18/08 Processes
• CPC Class Codes: C08G 69/18 Anionic polymerisation
• CPC Class Codes: C08K 13/02 Organic and inorganic ingredients
• CPC Class Codes: C08K 5/54 Silicon-containing compounds C08K5/0091 takes precedence
• CPC Class Codes: C08K 7/26 Silicon- containing compounds
• CPC Class Codes: C08K 9/06 with silicon-containing compounds
• CPC Class Codes: C08L 2666/72 Fillers; Inorganic pigments; Reinforcing additives
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 77/00 Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 77/02 Polyamides derived from omega-amino carboxylic acids or from lactams thereof C08L77/10 takes precedence
• CPC Class Codes: G11C 15/00 Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores

Claims

1. A REINFORCED POLYMERIC COMPOSITION COMPRISING A POLYAMIDE AND AT LEAST ABOUT 25% BY VOLUME OF AN INORGANIC FILLER MATERIAL HAVING A LENGTH TO DIAMETER RATIO OF UP TO ABOUT 25 TO 1, SAID MATERIAL HAVING BEEN TREATED WITH AN ORGANOSILANE COUPLING AGENT OF THE FORMULA