CPC Class Codes
B23K 20/007
Ball bonding
B23K 5/006
specially adapted for parti...
H01L 2224/023
Redistribution layers [RDL]...
H01L 2224/05599
Material
H01L 2224/45015
being circular
H01L 2224/45099
Material
H01L 2224/45144
Gold (Au) as principal cons...
H01L 2224/48091
Arched
H01L 2224/48247
connecting the wire to a bo...
H01L 2224/48465
the other connecting portio...
H01L 2224/48599
Principal constituent of th...
H01L 2224/73265
Layer and wire connectors
H01L 2224/78301
Capillary
H01L 2224/78344
Eccentric cams
H01L 2224/85181
connecting first on the sem...
H01L 2224/85201
Compression bonding
H01L 2224/85203
Thermocompression bonding
H01L 2224/85399
Material
H01L 24/45
of an individual wire conne...
H01L 24/48
of an individual wire conne...
H01L 24/78 :
Apparatus for connecting wi...
H01L 24/85 :
using a wire connector wire...
H01L 2924/00 :
Indexing scheme for arrange...
H01L 2924/0001 :
Technical content checked b...
H01L 2924/00014 :
the subject-matter covered ...
H01L 2924/01006 :
Carbon [C]
H01L 2924/01013 :
Aluminum [Al]
H01L 2924/01079 :
Gold [Au]
H01L 2924/14 :
Integrated circuits
H01L 2924/16195 :
Flat cap [not enclosing an ...
H01L 2924/20752 :
larger or equal to 20 micro...
Y10S 228/904 :
Wire bonding
Y10T 29/26 :
Paper-fastener making
Y10T 29/49121 :
Beam lead frame or beam lea...
View All