INTERCONNECTION STRUCTURE AND METHOD OF MAKING SAME

• US 3,434,204 A
• Filed: 05/26/1967
• Issued: 03/25/1969
• Est. Priority Date: 01/19/1965
• Status: Expired due to Term

• Current Assignee: Dimitry G. Grabbe
• Original Assignee: Dimitry G. Grabbe
• Inventors: Grabbe, Dimitry G.
• Application Number:
  US04/649,775
• Time in Patent Office: 669 Days
• US Class Current: 438/107
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Claims

1. A METHOD OF MAKING AN INTERCONNECTION STRUCTURE FOR A SOLID-STATE MEMBER COMPRISING:

POSITIONING A SOLID-STATE MEMBER HAVING TERMINAL REGIONS AT AN EDGE THEREOF ON AN INSULATING SUPPORT HAVING CONDUCTIVE TERMINALS EXTENDING THROUGH A SURFACE THEREOF IN A PREDETERMINED PATTERN CORRESPONDING TO SAID TERMINAL REGIONS OF SAID SOLID-STATE MEMBER WITH SAID TERMINAL REGIONS OF SAID SOLID-STATE MEMBER IS CLOSE PROXIMITY TO AND IN REGISTER WITH SAID TERMINALS OF SAID SUPPORT;