MANUFACTURE OF CIRCUIT MODULES USING ETCHED MOLDS

• US 3,438,127 A
• Filed: 10/21/1965
• Issued: 04/15/1969
• Est. Priority Date: 10/21/1965
• Status: Expired due to Term

• Current Assignee: Edwin W. Lehtonen
• Original Assignee: Edwin W. Lehtonen
• Inventors: Lehtonen, Edwin W.
• Application Number:
  US04/499,412
• Time in Patent Office: 1,272 Days
• US Class Current: 29/848
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2203/025 Abrading, e.g. grinding or sand blasting deburring, rounding, bevelling or smoothing conductor edges H05K2203/0346
• CPC Class Codes: H05K 2203/1152 Replicating the surface structure of a sacrificial layer, e.g. for roughening
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/045 by making a conductive layer having a relief pattern, followed by abrading of the raised portions
• CPC Class Codes: H05K 3/107 by filling grooves in the support with conductive material H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/381 by special treatment of the substrate
• CPC Class Codes: Y10T 29/49158 with molding of insulated base
• CPC Class Codes: Y10T 29/49984 and casting
• CPC Class Codes: Y10T 29/49993 Filling of opening

Claims