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METHOD OF BONDING A SEMI-CONDUCTOR TO A METAL CONDUCTOR AND RESULTANT PRODUCT

  • US 3,494,803 A
  • Filed: 05/12/1966
  • Issued: 02/10/1970
  • Est. Priority Date: 05/12/1966
  • Status: Expired due to Term
First Claim
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1. A THERMOELECTRIC DEVICE FOR HIGH TEMPERATURE USE COMPRISING TWO THERMOELEMENTS OF THERMOELECTRICALLY COMPLEMENTARY MATERIAL, SAID THERMOELEMENTS BEING JOINED AT ONE END BY A COMMON METAL CONDUCTOR TO FORM A HIGH TEMPERATURE THERMOELECTRIC JUNCTION BY MEANS OF A TRANSITION BONDING MATERIAL INCLUDING A METAL AND A SUBSTANTIALLY NEUTRAL SEMICONDUCTOR WHICH IS ARRANGED TO MAKE A GRADUAL TRANSITION FROM THE COMMON COMPOSITION OF THE METAL CONDUCTOR TO THE COMPOSITION OF THE COMPLEMENTARY THERMOELECTRIC ELEMENTS.

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