METHOD OF BONDING A SEMI-CONDUCTOR TO A METAL CONDUCTOR AND RESULTANT PRODUCT
First Claim
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1. A THERMOELECTRIC DEVICE FOR HIGH TEMPERATURE USE COMPRISING TWO THERMOELEMENTS OF THERMOELECTRICALLY COMPLEMENTARY MATERIAL, SAID THERMOELEMENTS BEING JOINED AT ONE END BY A COMMON METAL CONDUCTOR TO FORM A HIGH TEMPERATURE THERMOELECTRIC JUNCTION BY MEANS OF A TRANSITION BONDING MATERIAL INCLUDING A METAL AND A SUBSTANTIALLY NEUTRAL SEMICONDUCTOR WHICH IS ARRANGED TO MAKE A GRADUAL TRANSITION FROM THE COMMON COMPOSITION OF THE METAL CONDUCTOR TO THE COMPOSITION OF THE COMPLEMENTARY THERMOELECTRIC ELEMENTS.
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11 Claims
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1. A THERMOELECTRIC DEVICE FOR HIGH TEMPERATURE USE COMPRISING TWO THERMOELEMENTS OF THERMOELECTRICALLY COMPLEMENTARY MATERIAL, SAID THERMOELEMENTS BEING JOINED AT ONE END BY A COMMON METAL CONDUCTOR TO FORM A HIGH TEMPERATURE THERMOELECTRIC JUNCTION BY MEANS OF A TRANSITION BONDING MATERIAL INCLUDING A METAL AND A SUBSTANTIALLY NEUTRAL SEMICONDUCTOR WHICH IS ARRANGED TO MAKE A GRADUAL TRANSITION FROM THE COMMON COMPOSITION OF THE METAL CONDUCTOR TO THE COMPOSITION OF THE COMPLEMENTARY THERMOELECTRIC ELEMENTS.
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11. A METHOD OF FORMING A LAMINATED TRANSITION BONDING SURFACE BETWEEN A CONDUCTOR AND A THERMOELECTRIC ELEMENT COMPRISING FUSING A METAL MESH SCREEN MATERIAL TO A METAL CONDUCTOR, EMBEDDING AND OVERLAYING SAID SCREEN MATERIAL WITH A SUBSTANTIALLY NEUTRAL SEMICONDUCTOR MATERIAL.
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