Solutions
Empower Patent Analytics
Empower Litigation Defense
Empower License Manager
Use Cases
Patent Licensing
Portfolio Management
Litigation Strategy
Market Intelligence
Data Platform
Contact Us
Login
×
View as Organization
PROCESS FOR IMPROVING PHOTORESIST ADHESION
US 3,549,368 A
Filed
: 07/02/1968
Issued
: 12/22/1970
Est. Priority Date
: 07/02/1968
Status: Expired due to Term
Alert
Pin
0
Associated Cases
0
Associated Defendants
0
Product Citations
0
Petitions
84
Forward Citations
0
Assignments
First Claim
Patent Images
View all claims
0 Assignments
Timeline View
Assignment View
Subscription Required
This content requires a subscription to view
Contact Us
or
Login
Subscription Required
This content requires a subscription to view
Contact Us
or
Login
0 Petitions
Subscription Required
This content requires a subscription to view
Contact Us
or
Login
Accused Products
Subscription Required
This content requires a subscription to view
Contact Us
or
Login
Citations
0 Claims
Specification
Resources
Litigation Campaign Assessment
Thank you for your request. You will receive a custom alert email when the Litigation Campaign Assessment is available.
×
Current Assignee
Frank T. Deverse
,
Robert H. Collins
Original Assignee
Frank T. Deverse
,
Robert H. Collins
Inventors
Collins, Robert H.
,
Deverse, Frank T.
Application Number
US04/742,025
Time in Patent Office
903 Days
Field of Search
US Class Current
430/272.1
CPC Class Codes
G03F 7/0751
used as adhesion-promoting ...
H01L 21/02118
carbon based polymeric orga...
H01L 21/02123
the material containing sil...
H01L 21/02282
liquid deposition, e.g. spi...
H01L 21/02304
formation of intermediate l...
H01L 21/312
Organic layers, e.g. photor...
H01L 21/3121
Layers comprising organo-si...
H01L 29/00
Semiconductor devices speci...
Y10S 430/136
Coating process making radi...
Subscription Required
This content requires a subscription to view
Contact Us
or
Login
×
×