CPC Class Codes
H01L 2224/45124
Aluminium (Al) as principal...
H01L 2224/45144
Gold (Au) as principal cons...
H01L 2224/48091
Arched
H01L 2224/48247
connecting the wire to a bo...
H01L 23/488
consisting of soldered or b...
H01L 23/49562
for devices being provided ...
H01L 23/66
High-frequency adaptations
H01L 24/45
of an individual wire conne...
H01L 24/48
of an individual wire conne...
H01L 24/80
Methods for connecting semi...
H01L 2924/00
Indexing scheme for arrange...
H01L 2924/00014
the subject-matter covered ...
H01L 2924/01005
Boron [B]
H01L 2924/01006
Carbon [C]
H01L 2924/01013
Aluminum [Al]
H01L 2924/01019
Potassium [K]
H01L 2924/01029
Copper [Cu]
H01L 2924/01033
Arsenic [As]
H01L 2924/01039
Yttrium [Y]
H01L 2924/01074
Tungsten [W]
H01L 2924/01075 :
Rhenium [Re]
H01L 2924/01079 :
Gold [Au]
H01L 2924/01082 :
Lead [Pb]
H01L 2924/014 :
Solder alloys
H01L 2924/1306 :
Field-effect transistor [FET]
H01L 2924/14 :
Integrated circuits
H01L 2924/19041 :
being a capacitor
H01L 2924/30107 :
Inductance
H01L 2924/3011 :
Impedance
H05K 1/0216 :
Reduction of cross-talk, no...
H05K 1/116 :
Lands, clearance holes or o...
H05K 2201/0792 :
Means against parasitic imp...
H05K 2201/09772 :
Conductors directly under a...
H05K 2201/10166 :
Transistor
H05K 3/3447 :
Lead-in-hole components H05...
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